18131917. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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SEMICONDUCTOR DEVICE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Juseong Oh of Suwon-si (KR)

SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18131917 titled 'SEMICONDUCTOR DEVICE

Simplified Explanation

The semiconductor device described in the patent application includes a substrate, lower electrodes, a dielectric layer, an upper electrode, a contact structure, and a wiring layer. The contact structure consists of a lower plug and an upper plug, with the upper surface of the lower plug being coplanar with the upper surface of the upper electrode. The upper surface of the lower plug is narrower than the lower surface of the upper plug, and the lower surface of the upper plug is in contact with the upper surface of the lower plug.

  • The semiconductor device includes a unique contact structure with a lower plug and an upper plug.
  • The upper surface of the lower plug is coplanar with the upper surface of the upper electrode.
  • The upper surface of the lower plug is narrower than the lower surface of the upper plug.
  • The lower surface of the upper plug is in contact with the upper surface of the lower plug.

Potential Applications:

  • This semiconductor device can be used in various electronic devices such as smartphones, tablets, and computers.
  • It can be utilized in integrated circuits, memory devices, and microprocessors.

Problems Solved:

  • The contact structure ensures a reliable and efficient connection between the upper electrode and the wiring layer.
  • It prevents any potential short circuits or electrical failures.

Benefits:

  • The coplanar upper surfaces of the lower plug and the upper electrode improve the overall performance and reliability of the semiconductor device.
  • The contact structure provides a stable and secure connection, reducing the risk of electrical failures.
  • The narrower upper surface of the lower plug allows for more precise and compact designs, enabling miniaturization of electronic devices.


Original Abstract Submitted

A semiconductor device includes a substrate; lower electrodes on the substrate; a dielectric layer on the lower electrodes; an upper electrode on the dielectric layer; a contact structure connected to the upper electrode; and a wiring layer on the contact structure, wherein the contact structure includes a lower plug, and an upper plug on the lower plug, an upper surface of the lower plug is substantially coplanar with an upper surface of the upper electrode, a first width of the upper surface of the lower plug is narrower than a second width of a lower surface of the upper plug, and the lower surface of the upper plug is in contact with the upper surface of the lower plug.

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