18130001. SUPERCRITICAL FLUID SUPPLY APPARATUS, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
SUPERCRITICAL FLUID SUPPLY APPARATUS, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME
Organization Name
Inventor(s)
SANGJINE Park of Suwon-si (KR)
SUPERCRITICAL FLUID SUPPLY APPARATUS, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18130001 titled 'SUPERCRITICAL FLUID SUPPLY APPARATUS, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME
Simplified Explanation
- Supercritical fluid supply apparatuses, substrate processing apparatuses, and substrate processing methods are disclosed in this patent application. - The substrate processing apparatus includes a dry chamber for holding a substrate and a supercritical fluid supply apparatus for supplying supercritical fluid to the dry chamber. - The supercritical fluid supply apparatus consists of a fluid supply tank, a high-temperature fluid tank, and a low-temperature fluid tank connected in parallel between the fluid supply tank and the dry chamber. - The high-temperature fluid tank stores fluid at a first temperature, while the low-temperature fluid tank stores fluid at a second temperature different from the first temperature.
- Potential Applications:
- Semiconductor manufacturing - Thin film deposition processes - Pharmaceutical industry for drug delivery systems
- Problems Solved:
- Precise control and delivery of supercritical fluids - Uniform substrate processing - Enhanced efficiency in substrate treatment
- Benefits:
- Improved quality and consistency of substrate processing - Increased productivity and throughput - Cost-effective and energy-efficient processing methods
Original Abstract Submitted
Disclosed are supercritical fluid supply apparatuses, substrate processing apparatuses, and substrate processing methods. The substrate processing apparatus comprises a dry chamber including a dry space configured in which to dispose a substrate, and a supercritical fluid supply apparatus configured to supply the dry chamber with a supercritical fluid. The supercritical fluid supply apparatus includes a fluid supply tank, a high-temperature fluid tank configured in which to store a fluid supplied from the fluid supply tank at a first temperature, and a low-temperature fluid tank configured in which to store a fluid supplied from the fluid supply tank at a second temperature different from the first temperature. The high-temperature fluid tank and the low-temperature fluid tank are connected in parallel between the fluid supply tank and the dry chamber.
