18127531. SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
Organization Name
Inventor(s)
Byungkeun Kang of Suwon-si (KR)
Gongmyeong Kim of Suwon-si (KR)
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18127531 titled 'SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
Simplified Explanation
The abstract describes a method of manufacturing an electronic device using a substrate with mounting regions for electronic components. Vapor passage holes are formed in the substrate, and the electronic components are disposed on the substrate using bumps. A first heat transfer fluid is heated to generate a second heat transfer fluid in a vapor state. At least a portion of the second heat transfer fluid is supplied through the vapor passage holes, and the bumps are soldered using the second heat transfer fluid in the vapor state.
- The method involves providing a substrate with mounting regions for electronic components.
- Vapor passage holes are formed in the substrate to allow the flow of heat transfer fluid.
- Electronic components are mounted on the substrate using bumps.
- A first heat transfer fluid is heated to generate a second heat transfer fluid in a vapor state.
- The second heat transfer fluid in the vapor state is supplied through the vapor passage holes.
- The bumps are soldered using the second heat transfer fluid in the vapor state.
Potential applications of this technology:
- Manufacturing of electronic devices such as smartphones, tablets, and computers.
- Production of circuit boards for various electronic systems.
- Assembly of electronic components in automotive and aerospace industries.
Problems solved by this technology:
- Efficient heat transfer during the soldering process.
- Improved reliability and performance of electronic devices.
- Enhanced manufacturing process for electronic components.
Benefits of this technology:
- Faster and more efficient soldering of electronic components.
- Improved heat dissipation and thermal management.
- Enhanced reliability and longevity of electronic devices.
- Cost-effective manufacturing process for electronic components.
Original Abstract Submitted
A method of manufacturing an electronic device, includes: providing a substrate including a plurality of mounting regions on which electronic components are mounted respectively; forming a plurality of vapor passage holes that penetrate the substrate; disposing the electronic components on the substrate via bumps; heating a first heat transfer fluid to generate a second heat transfer fluid in a vapor state; supplying at least a portion of the second heat transfer fluid in the vapor state through the vapor passage holes of the substrate; and soldering the bumps using the at least the portion of the second heat transfer fluid in the vapor state.
