18127513. SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
Organization Name
Inventor(s)
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18127513 titled 'SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
Simplified Explanation
The patent application describes an apparatus that includes a vapor generating chamber, a heater, a substrate stage, and at least one mesh plate.
- The vapor generating chamber is designed to hold a heat transfer fluid and generate saturated vapor.
- The heater is responsible for heating the heat transfer fluid in the vapor generating chamber.
- The substrate stage is movable within the chamber and supports a substrate with an electronic device mounted on it using solder.
- The at least one mesh plate extends horizontally within the vapor generating chamber and has multiple openings for the vapor to pass through.
Potential Applications:
- This apparatus can be used in the manufacturing of electronic devices that require soldering, such as circuit boards or microchips.
- It can also be utilized in industries that involve heat transfer processes, such as power generation or chemical manufacturing.
Problems Solved:
- The apparatus provides a controlled environment for generating saturated vapor, which is crucial for certain manufacturing processes.
- The movable substrate stage allows for precise positioning of the electronic device during soldering, ensuring accurate and reliable connections.
Benefits:
- The apparatus enables efficient and reliable soldering of electronic devices by utilizing saturated vapor.
- The movable substrate stage allows for flexibility in positioning the electronic device, improving the quality of soldering.
- The mesh plate design enhances the flow of vapor, ensuring uniform heating and soldering of the electronic device.
Original Abstract Submitted
An apparatus includes: a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated by the heat transfer fluid; a heater configured to heat the heat transfer fluid in the vapor generating chamber; a substrate stage configured to be movable upward or downward in the vapor generating chamber and to support a substrate on which an electronic device is mounted via a solder. The apparatus also includes at least one mesh plate extending in a horizontal direction in the vapor generating chamber. The at least one mesh plate includes a plurality of openings through which the vapor moves.
