18127118. RESIST COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
RESIST COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
Organization Name
Inventor(s)
Jaemyoung Kim of Suwon-si (KR)
RESIST COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18127118 titled 'RESIST COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
Simplified Explanation
The patent application describes a resist composition for manufacturing semiconductor devices, which includes an organometallic compound with a central metal and ligands, as well as an excess ligand compound that can bond with the central metal through coordination.
- Organometallic compound with central metal and ligands
- Excess ligand compound for coordination with central metal
Potential Applications
- Semiconductor device manufacturing
- Photolithography processes
Problems Solved
- Improving resolution in semiconductor device fabrication
- Enhancing sensitivity of resist materials
Benefits
- Increased precision in patterning
- Enhanced performance of semiconductor devices
Original Abstract Submitted
A resist composition and a method of manufacturing a semiconductor device, the resist composition includes an organometallic compound, the organometallic compound including a central metal and ligands combined with the central metal; and an excess ligand compound, the excess ligand compound being combinable with the central metal via a coordination bond.
