18126858. SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
Organization Name
Inventor(s)
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18126858 titled 'SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
Simplified Explanation
The abstract describes a solder reflow apparatus that includes a chamber for generating vapor by heating a heat transfer fluid. The apparatus also includes a heater to heat the fluid, a movable substrate stage with vapor and suction passages, and a partial vacuum generated in the suction passages.
- The solder reflow apparatus generates vapor by heating a heat transfer fluid.
- The apparatus includes a heater to heat the heat transfer fluid.
- A movable substrate stage is present within the vapor generating chamber.
- The substrate stage has vapor passages that allow the vapor to move through it.
- Suction passages are also present in the substrate stage, generating a partial vacuum.
- The suction passages are open to the seating surface of the substrate stage.
Potential applications of this technology:
- Solder reflow processes in electronics manufacturing.
- Heat transfer and vapor generation in various industrial applications.
- Controlled heating and cooling processes in scientific research.
Problems solved by this technology:
- Efficient and controlled solder reflow processes.
- Improved heat transfer and vapor generation.
- Enhanced control over heating and cooling processes.
Benefits of this technology:
- Faster and more precise solder reflow processes.
- Improved heat transfer efficiency.
- Enhanced control and flexibility in heating and cooling applications.
Original Abstract Submitted
A solder reflow apparatus includes a vapor generating chamber configured to accommodate a heat transfer fluid and to accommodate saturated vapor generated by heating the heat transfer fluid; a heater configured to heat the heat transfer fluid accommodated in the vapor generating chamber; a substrate stage configured to be movable upward and downward within the vapor generating chamber, the substrate stage including a seating surface; vapor passages penetrating the substrate stage and configured to allow the vapor to move therethrough; and suction passages penetrating the substrate stage to be open to the seating surface and in which at least a partial vacuum is generated.
