18126767. SYSTEM AND METHOD OF BUMP MAP DETERMINATION AND BUMP ARRAY FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)
Contents
- 1 SYSTEM AND METHOD OF BUMP MAP DETERMINATION AND BUMP ARRAY FORMATION
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SYSTEM AND METHOD OF BUMP MAP DETERMINATION AND BUMP ARRAY FORMATION - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SYSTEM AND METHOD OF BUMP MAP DETERMINATION AND BUMP ARRAY FORMATION
Organization Name
Taiwan Semiconductor Manufacturing Company Limited
Inventor(s)
Shih Hsuan Hsu of Hsin-Chu (TW)
Chan-Chung Cheng of Kaohsiung (TW)
Chun-Chen Liu of Kaohsiung (TW)
Cheng-Hung Chen of Tainan (TW)
Peng-Ren Chen of Hsin-Chu (TW)
Wen-Hao Cheng of Hsin-Chu (TW)
SYSTEM AND METHOD OF BUMP MAP DETERMINATION AND BUMP ARRAY FORMATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 18126767 titled 'SYSTEM AND METHOD OF BUMP MAP DETERMINATION AND BUMP ARRAY FORMATION
Simplified Explanation
The method described in the patent application involves determining bump maps and bump densities to create a second bump map with sizes of bumps.
- Determining a first bump map indicating positions of bumps
- Calculating a first plurality of bump densities based on the first bump map
- Smoothing the first bump densities to determine a second plurality of bump densities
- Creating a second bump map based on the second bump densities and sizes of the bumps
Potential Applications
This technology could be applied in the fields of computer graphics, virtual reality, and 3D modeling for creating realistic textures and surfaces.
Problems Solved
This technology solves the problem of accurately representing and generating bump maps with varying densities and sizes of bumps.
Benefits
The benefits of this technology include improved visual quality in graphics, enhanced realism in virtual environments, and more detailed 3D models.
Potential Commercial Applications
Potential commercial applications of this technology could be in video game development, animation studios, architectural visualization, and product design industries.
Possible Prior Art
One possible prior art for this technology could be the use of bump mapping techniques in computer graphics and rendering software.
Unanswered Questions
How does this method compare to existing bump mapping techniques?
The article does not provide a direct comparison to existing bump mapping methods in terms of efficiency, accuracy, or computational complexity.
Are there any limitations or constraints in the implementation of this method?
The article does not mention any potential limitations or constraints that may arise when implementing this method in practical applications.
Original Abstract Submitted
A method is provided. The method includes determining a first bump map indicative of a first set of positions of bumps. The method includes determining, based upon the first bump map, a first plurality of bump densities associated with a plurality of regions of the first bump map. The method includes smoothing the first plurality of bump densities to determine a second plurality of bump densities associated with the plurality of regions of the first bump map. The method includes determining, based upon the second plurality of bump densities, a second bump map indicative of the first set of positions of the bumps and a set of sizes of the bumps.
