18126395. SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)

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SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Seonhaeng Lee of Suwon-si (KR)

SANGWOO Pae of Suwon-si (KR)

NAMHYUN Lee of Suwon-si (KR)

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18126395 titled 'SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME

Simplified Explanation

The abstract describes a semiconductor memory structure with specific components and configurations.

  • Substrate with buried dielectric layer and first recess
  • Word line in the first recess
  • First and second source/drain patterns on opposite sides of the word line
  • Channel pattern between the word line and the first recess, contacting the source/drain patterns
  • Bit line connected to the second source/drain pattern, extending in a direction intersecting the first direction
  • Channel pattern with vertical and horizontal parts, with vertical parts on lateral surfaces of the word line and horizontal part below the word line

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      1. Potential Applications
  • Memory devices
  • Integrated circuits
  • Data storage systems
      1. Problems Solved
  • Efficient memory storage
  • Improved data retrieval speed
  • Enhanced performance of semiconductor devices
      1. Benefits
  • Higher memory density
  • Faster data access
  • Increased overall efficiency of semiconductor memory systems


Original Abstract Submitted

A semiconductor memory may include a substrate, a buried dielectric layer on the substrate and providing a first recess that extends in a first direction, a word line in the first recess of the buried dielectric layer, first and second source/drain patterns on opposite sides of the word line, a channel pattern between the word line and the first recess of the buried dielectric layer and contacting the first and second source/drain patterns, and a bit line electrically connected to the second source/drain pattern and extending in a second direction that intersects the first direction. The channel pattern includes vertical parts and a horizontal part connected to each other. The vertical parts are on opposite lateral surfaces of the word line. The horizontal part is below the word line.