18125958. METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Kyoungok Jung of Suwon-si (KR)
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18125958 titled 'METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
Simplified Explanation
The abstract of the patent application describes a method of manufacturing a semiconductor package. The method involves the following steps:
1. Forming multiple conductive patterns on a substrate. 2. Applying a photoresist film over the substrate to cover the conductive patterns. 3. Creating a photoresist pattern from the film using photolithography, with the help of a photomask that has transparent, light-shielding, and semi-transparent areas. 4. The photoresist pattern includes a via hole that exposes one conductive pattern and a recessed portion with a lower surface that exposes a part of the photoresist pattern. 5. Forming a conductive post in the via hole. 6. Removing the photoresist pattern using a photoresist stripping composition.
Bullet points to explain the patent/innovation:
- The method involves the use of photolithography and a photomask to create a photoresist pattern on a substrate.
- The photoresist pattern includes a via hole that exposes a conductive pattern and a recessed portion that exposes a part of the photoresist pattern.
- A conductive post is formed in the via hole, allowing for electrical connections.
- The photoresist pattern is then removed using a photoresist stripping composition.
Potential applications of this technology:
- Semiconductor manufacturing: This method can be used in the production of semiconductor packages, allowing for the creation of precise conductive patterns and electrical connections.
Problems solved by this technology:
- Precise patterning: The use of photolithography and a photomask enables the creation of precise conductive patterns and via holes, ensuring accurate electrical connections.
- Efficient removal of photoresist: The photoresist stripping composition effectively removes the photoresist pattern, leaving behind the desired conductive structures.
Benefits of this technology:
- Improved manufacturing process: The method provides a reliable and efficient way to manufacture semiconductor packages with precise conductive patterns and electrical connections.
- Cost-effective: The use of photolithography and photoresist stripping composition allows for high-volume production at a lower cost compared to alternative methods.
Original Abstract Submitted
A method of manufacturing a semiconductor package includes forming a plurality of conductive patterns on a substrate, forming a photoresist film over the substrate to cover the plurality of conductive patterns, forming a photoresist pattern from the photoresist film by a photolithography process using a photomask that includes a transparent area, a light-shielding area, and a semi-transparent area transmitting only a portion of light incident thereon, wherein the photoresist pattern includes a via hole, which exposes one conductive pattern, and a recessed portion, which has a lower surface exposing a portion of the photoresist pattern, forming a conductive post in the via hole, and removing the photoresist pattern by using a photoresist stripping composition.
