18125409. SEMICONDUCTOR PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
Organization Name
Inventor(s)
Seonghwan Jeon of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18125409 titled 'SEMICONDUCTOR PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
Simplified Explanation
The patent application describes a semiconductor package that includes a base film, conductive structures, a via, a semiconductor chip, insulating layers, and conductive layers.
- The semiconductor package includes a base film.
- There are conductive structures on both surfaces of the base film.
- A via passes through the base film, connecting the conductive structures.
- A semiconductor chip is placed on one surface of the base film and connected to one of the conductive structures.
- An insulating layer covers the conductive structure and has an opening exposing a conductive pattern.
- A conductive layer is placed on the insulating layer, covering it and the semiconductor chip, and contacting the exposed conductive pattern.
- Another conductive layer is placed on the other surface of the base film, covering the conductive structure and making contact with it.
Potential applications of this technology:
- Semiconductor packaging for electronic devices.
- Integrated circuits and microchips.
Problems solved by this technology:
- Provides a structure for connecting conductive structures on both surfaces of a base film.
- Allows for efficient electrical connections between the semiconductor chip and the conductive structures.
Benefits of this technology:
- Improved electrical connectivity and performance.
- Enhanced reliability and durability of the semiconductor package.
- Simplified manufacturing process.
Original Abstract Submitted
A semiconductor package includes a base film, a first conductive structure disposed on a first surface of the base film, a second conductive structure disposed on a second surface of the base film, a via passing through the base film and connecting the first conductive structure to the second conductive structure, a semiconductor chip on the first surface and electrically connected to the first conductive structure, a first insulating layer covering the first conductive structure and including a first opening exposing a first conductive pattern of the first conductive structure, a first conductive layer disposed on the first insulating layer, covering the first insulating layer and the semiconductor chip, and contacting a region of the first conductive pattern exposed by the first opening, and a second conductive layer disposed on the second surface, covering the second conductive structure, and contacting at least a portion of the second conductive structure.
