18124255. RELEASE FILM FOR MOLD PROCESS, AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
RELEASE FILM FOR MOLD PROCESS, AND METHOD FOR MANUFACTURING THE SAME
Organization Name
Inventor(s)
RELEASE FILM FOR MOLD PROCESS, AND METHOD FOR MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18124255 titled 'RELEASE FILM FOR MOLD PROCESS, AND METHOD FOR MANUFACTURING THE SAME
Simplified Explanation
The abstract of this patent application describes a release film for a mold process that can minimize defects in a semiconductor package during the packaging process. The release film consists of a base film and multiple conductive fillers embedded within the base film, arranged on both the upper and lower surfaces. The conductive fillers create roughness on the surfaces of the base film and form a conductive path between them.
- The release film is designed for use in a mold process for semiconductor packaging.
- It includes a base film and conductive fillers embedded within the film.
- The conductive fillers are arranged on the upper and/or lower surfaces of the base film.
- The conductive fillers create roughness on the surfaces of the base film.
- A conductive path is formed between the upper and lower surfaces of the base film.
Potential applications of this technology:
- Semiconductor packaging processes: The release film can be used in the mold process for semiconductor packaging to minimize defects in the semiconductor package.
- Electronics manufacturing: The release film may find applications in other electronic manufacturing processes that require the use of molds.
Problems solved by this technology:
- Defect minimization: The release film helps minimize defects in the semiconductor package during the packaging process.
- Improved quality control: By reducing defects, the technology improves the overall quality control of semiconductor packaging.
Benefits of this technology:
- Enhanced semiconductor package quality: The use of the release film can lead to improved quality of the semiconductor package by minimizing defects.
- Cost savings: Minimizing defects can reduce the need for rework or scrap, resulting in cost savings in the semiconductor packaging process.
- Increased efficiency: The technology can improve the efficiency of the semiconductor packaging process by reducing the occurrence of defects and the associated rework or scrap.
Original Abstract Submitted
A release film for a mold process capable of minimizing defects of a semiconductor package in a semiconductor packaging process, and a method for manufacturing the release film for a mold process are provided. The release film for the mold process includes a base film and a plurality of conductive fillers located inside the base film and arranged on upper and/or lower surfaces of the base film, wherein roughness is formed by the plurality of conductive fillers on the upper and/or lower surfaces of the base film, and a conductive path is formed between the upper and lower surfaces of the base film.
