18116711. SEMICONDUCTOR DEVICE simplified abstract (TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION)
Contents
SEMICONDUCTOR DEVICE
Organization Name
TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
Inventor(s)
Kyo Tanabiki of Himeji Hyogo (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18116711 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation
The semiconductor device described in the abstract includes a chip with a first electrode, a first connector above the first electrode, and a joint member for joining the first electrode and the joint portion of the first connector. The joint portion of the first connector has a notch portion on at least one end of its upper surface, and the joint member is in contact with the first electrode and at least part of the notch portion.
- Explanation of the patent/innovation:
- Semiconductor device with improved joint structure for connecting electrodes and connectors. - Notch portion on joint portion of connector for enhanced connection. - Joint member ensures secure contact between electrode and connector.
- Potential applications of this technology:
- Semiconductor manufacturing - Electronics industry - Automotive electronics
- Problems solved by this technology:
- Ensures secure and reliable connection between electrodes and connectors. - Improves overall performance and longevity of semiconductor devices.
- Benefits of this technology:
- Enhanced reliability and durability of semiconductor devices. - Improved electrical conductivity. - Simplified manufacturing process.
- Potential commercial applications of this technology:
- Semiconductor companies - Electronics manufacturers - Automotive industry suppliers
- Possible prior art:
- Previous methods of connecting electrodes and connectors in semiconductor devices may not have included the specific notch portion and joint member described in this patent application.
Questions:
1. How does the notch portion on the joint portion of the connector improve the connection between the electrode and the connector? 2. What specific industries could benefit the most from the enhanced reliability and durability of semiconductor devices using this technology?
Original Abstract Submitted
According to one embodiment, a semiconductor device includes: a chip; a first electrode provided on the chip; a first connector provided above the first electrode, extending in a first direction, and provided with a joint portion to be joined to the first electrode, on an end portion in the first direction of the first connector; and a joint member for use in joint between the first electrode and the joint portion. The joint portion is provided with a notch portion on at least one end portion in the first direction of an upper surface of the joint portion. The joint member is in contact with the first electrode, a lower surface of the joint portion facing the first electrode, and at least, part of the notch portion.
