18116711. SEMICONDUCTOR DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)
Contents
- 1 SEMICONDUCTOR DEVICE
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Kyo Tanabiki of Himeji Hyogo (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18116711 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation
The semiconductor device described in the patent application includes a chip with a first electrode, a first connector above the first electrode, and a joint member for joining the first electrode and the joint portion of the first connector. The joint portion of the first connector has a notch portion on at least one end of its upper surface, and the joint member is in contact with the first electrode and the lower surface of the joint portion.
- The semiconductor device includes a chip with a first electrode.
- A first connector is provided above the first electrode, extending in a first direction.
- The first connector has a joint portion to be joined to the first electrode.
- A joint member is used for the joint between the first electrode and the joint portion.
- The joint portion of the first connector has a notch portion on at least one end of its upper surface.
- The joint member is in contact with the first electrode and the lower surface of the joint portion.
Potential Applications
This technology could be applied in various semiconductor devices, such as integrated circuits, sensors, and memory devices.
Problems Solved
This technology solves the problem of ensuring a secure and reliable connection between the first electrode and the first connector in a semiconductor device.
Benefits
The benefits of this technology include improved electrical conductivity, enhanced device performance, and increased durability of the semiconductor device.
Potential Commercial Applications
Potential commercial applications of this technology could include the manufacturing of advanced electronic devices, automotive electronics, and telecommunications equipment.
Possible Prior Art
One possible prior art for this technology could be the use of soldering techniques in semiconductor device manufacturing to create connections between electrodes and connectors.
Unanswered Questions
How does this technology compare to traditional soldering techniques in terms of reliability and performance?
This article does not provide a direct comparison between this technology and traditional soldering techniques in semiconductor device manufacturing.
What are the potential cost implications of implementing this technology in semiconductor device production?
The article does not address the potential cost implications of incorporating this technology into the manufacturing process of semiconductor devices.
Original Abstract Submitted
According to one embodiment, a semiconductor device includes: a chip; a first electrode provided on the chip; a first connector provided above the first electrode, extending in a first direction, and provided with a joint portion to be joined to the first electrode, on an end portion in the first direction of the first connector; and a joint member for use in joint between the first electrode and the joint portion. The joint portion is provided with a notch portion on at least one end portion in the first direction of an upper surface of the joint portion. The joint member is in contact with the first electrode, a lower surface of the joint portion facing the first electrode, and at least, part of the notch portion.
