18108657. MEMORY PACKAGE AND MEMORY MODULE INCLUDING THE MEMORY PACKAGE simplified abstract (SK hynix Inc.)
Contents
- 1 MEMORY PACKAGE AND MEMORY MODULE INCLUDING THE MEMORY PACKAGE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MEMORY PACKAGE AND MEMORY MODULE INCLUDING THE MEMORY PACKAGE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
MEMORY PACKAGE AND MEMORY MODULE INCLUDING THE MEMORY PACKAGE
Organization Name
Inventor(s)
Won Ha Choi of Gyeonggi-do (KR)
Han Suk Ko of Gyeonggi-do (KR)
Uksong Kang of Gyeonggi-do (KR)
MEMORY PACKAGE AND MEMORY MODULE INCLUDING THE MEMORY PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18108657 titled 'MEMORY PACKAGE AND MEMORY MODULE INCLUDING THE MEMORY PACKAGE
Simplified Explanation
The abstract of the patent application describes a memory package that includes a substrate, a memory chip, and a buffer chip integrated over the substrate. The memory chip contains an interface modulator embedded within, specifically a serializing modulator with a multi-level amplitude modulator.
- The memory package includes a substrate, memory chip, and buffer chip integrated over the substrate.
- The memory chip contains an interface modulator embedded within, which is a serializing modulator with a multi-level amplitude modulator.
Potential Applications
This technology could be applied in:
- High-speed data storage devices
- Networking equipment
- Embedded systems
Problems Solved
This technology helps address:
- Data transfer speed limitations
- Signal integrity issues
- Integration challenges in memory packages
Benefits
The benefits of this technology include:
- Improved data transfer rates
- Enhanced signal quality
- Simplified integration processes
Potential Commercial Applications
- Data centers
- Telecommunications industry
- Consumer electronics market
Possible Prior Art
One possible prior art could be the use of interface modulators in memory packages for improving data transfer speeds and signal quality.
Unanswered Questions
How does the interface modulator impact power consumption in the memory package?
The abstract does not provide information on the power consumption implications of the interface modulator.
Are there any specific industry standards or protocols that this technology aligns with?
The abstract does not mention any industry standards or protocols that the technology may adhere to.
Original Abstract Submitted
A single memory package includes: a substrate; and a memory chip and a buffer chip that are integrated over the substrate, wherein the memory chip includes an interface modulator embedded therein, and the interface modulator is a serializing modulator including a multi-level amplitude modulator.
