18108629. SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

JUNGMIN Park of Suwon-si (KR)

HANJIN Lim of Suwon-si (KR)

HYUNGSUK Jung of Suwon-si (KR)

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18108629 titled 'SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Simplified Explanation

The abstract describes a semiconductor device that includes a substrate, lower electrodes, a conductive pattern, supporting patterns, and conductive islands.

• The substrate is the base material on which the device is built.
• The lower electrodes are vertically extended on the substrate and spaced apart from each other horizontally.
• The conductive pattern is provided on the substrate and covers the lower electrodes in a conformal manner.
• The supporting patterns penetrate the conductive pattern and are connected to portions of the side surfaces of the lower electrodes.
• The conductive islands are disposed on the surfaces of the supporting patterns and may be distributed to be spaced apart from each other.
• The conductive pattern is spaced apart from and electrically disconnected from the conductive islands.

Potential applications of this technology:

• Semiconductor devices such as integrated circuits and transistors.
• Electronic devices such as smartphones, computers, and tablets.
• Power electronics and renewable energy systems.

Problems solved by this technology:

• Improved electrical conductivity and performance of semiconductor devices.
• Enhanced integration and miniaturization of electronic components.
• Better control and management of electrical signals.

Benefits of this technology:

• Increased efficiency and reliability of semiconductor devices.
• Reduced power consumption and heat generation.
• Enhanced functionality and performance of electronic devices.
• Cost-effective manufacturing processes.

Original Abstract Submitted

A semiconductor device comprising a substrate, lower electrodes vertically extended on the substrate and horizontally spaced apart from each other, a conductive pattern provided on the substrate to conformally cover the lower electrodes, supporting patterns provided to penetrate the conductive pattern and connected to portions of side surfaces of the lower electrodes, and conductive islands disposed on surfaces of the supporting patterns. The conductive islands may be distributed on the surfaces of the supporting patterns to be spaced apart from each other, and the conductive pattern may be spaced apart from and electrically disconnected from the conductive islands.