18107049. DEPOSITION APPARATUS AND DRIVING METHOD THEREOF simplified abstract (SAMSUNG DISPLAY CO., LTD.)
Contents
DEPOSITION APPARATUS AND DRIVING METHOD THEREOF
Organization Name
Inventor(s)
Jun Hyeuk Ko of Yongin-si (KR)
Min Goo Kang of Yongin-si (KR)
Min Seok Kim of Yongin-si (KR)
Min Chul Song of Yongin-si (KR)
Young Sun Cho of Yongin-si (KR)
DEPOSITION APPARATUS AND DRIVING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18107049 titled 'DEPOSITION APPARATUS AND DRIVING METHOD THEREOF
Simplified Explanation
The deposition apparatus described in the patent application includes a plate and electrostatic chucks. The electrostatic chucks have a first surface on which the plate is placed and a second surface on which a substrate is supported. The apparatus also includes a control device that controls the flatness between the electrostatic chucks. Each electrostatic chuck has driving shafts located at the edge of its first surface, and the control device adjusts the flatness between the chucks by measuring the height deviation between them.
- The patent application describes a deposition apparatus with electrostatic chucks that can control the flatness between them.
- The electrostatic chucks have a first surface for holding the plate and a second surface for supporting the substrate.
- The control device adjusts the flatness between the chucks by measuring the height deviation between them and controlling the driving shafts.
- The driving shafts are located at the edge of the first surface of each electrostatic chuck.
Potential applications of this technology:
- Semiconductor manufacturing: The deposition apparatus can be used in the production of semiconductors, where precise control of flatness is crucial for the quality of the final product.
- Thin film deposition: The apparatus can be used for depositing thin films on various substrates, such as glass or metal, where maintaining a flat surface is important for uniform deposition.
- Optical coatings: The technology can be applied in the production of optical coatings, where precise control of flatness is necessary for achieving desired optical properties.
Problems solved by this technology:
- Flatness control: The apparatus solves the problem of maintaining a flat surface between the electrostatic chucks during deposition processes, ensuring uniformity and quality of the deposited material.
- Height deviation measurement: The control device measures the height deviation between the chucks, allowing for accurate adjustment and control of the flatness.
Benefits of this technology:
- Improved deposition quality: The precise control of flatness between the electrostatic chucks ensures uniform deposition of materials, leading to improved product quality.
- Enhanced productivity: The automated control device allows for efficient and accurate adjustment of the flatness, reducing the need for manual intervention and increasing productivity.
- Cost savings: By minimizing height deviations and ensuring uniform deposition, the technology reduces material waste and improves overall process efficiency, resulting in cost savings.
Original Abstract Submitted
A deposition apparatus includes a plate; electrostatic chucks including a first surface on which the plate is disposed; and a second surface on which a substrate is supported; and a control device that controls a flatness between the electrostatic chucks, and each of the electrostatic chucks includes driving shafts disposed through an area of an edge of the first surface of each of the electrostatic chucks, and the control device controls the flatness between the electrostatic chucks through the driving shafts by measuring a height deviation between the electrostatic chucks.
