18106855. MICRO-LIGHT EMITTING DIODE DISPLAY AND METHODS OF MANUFACTURING AND OPERATING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
MICRO-LIGHT EMITTING DIODE DISPLAY AND METHODS OF MANUFACTURING AND OPERATING THE SAME
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MICRO-LIGHT EMITTING DIODE DISPLAY AND METHODS OF MANUFACTURING AND OPERATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18106855 titled 'MICRO-LIGHT EMITTING DIODE DISPLAY AND METHODS OF MANUFACTURING AND OPERATING THE SAME
Simplified Explanation
The patent application describes an ultra-high pixel per inch micro-light-emitting diode (LED) display with a field shielding member to protect the switching device from the field generated by the micro-LEDs during operation.
- The display includes a micro-LED layer with multiple micro-LEDs, a backplane layer with a switching device connected to the micro-LED layer, and a field shielding member between the micro-LEDs and the switching device.
- The field shielding member shields the switching device from the field generated by the micro-LEDs during operation.
- The micro-LED layer and the backplane layer are integrated into a single body in a stacked structure.
Potential applications of this technology:
- High-resolution displays for smartphones, tablets, and other electronic devices.
- Virtual reality and augmented reality headsets.
- Medical imaging devices.
- Automotive displays.
Problems solved by this technology:
- Prevents interference and damage to the switching device from the field generated by the micro-LEDs.
- Ensures reliable and stable operation of the ultra-high pixel per inch display.
Benefits of this technology:
- Improved display quality with ultra-high pixel per inch resolution.
- Enhanced durability and longevity of the display.
- Greater efficiency in managing the field generated by the micro-LEDs.
Original Abstract Submitted
An ultra-high pixel per inch (ppi) micro-light-emitting diode (LED) display includes a micro-LED layer including a plurality of micro-LEDs, a backplane layer including a switching device connected to the micro-LED layer, and a field shielding member provided between the plurality of micro-LEDs and the switching device, the field shielding member configured to shield the switching device from a field applied to the switching device from the plurality of micro-LEDs during an operation of the micro-LED display, where the micro-LED layer and the backplane layer form a single body in a sequentially stacked structure.
