18099697. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
Contents
- 1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Inventor(s)
Chuei-Tang Wang of Hsinchu (TW)
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18099697 titled 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The semiconductor device described in the abstract includes a substrate, a semiconductor component, and a heat dissipation component. The semiconductor component is placed on the substrate, while the heat dissipation component is also on the substrate and features a cavity, an inlet, and an outlet that connect to the cavity.
- The semiconductor device comprises a substrate, which serves as the foundation for the device.
- A semiconductor component is positioned on the substrate, likely to perform specific functions within the device.
- A heat dissipation component is also present on the substrate, designed to manage and dissipate heat generated by the semiconductor component.
- The heat dissipation component includes a cavity, an inlet, and an outlet that are interconnected, possibly to facilitate the flow of air or coolant for heat dissipation.
Potential Applications
The technology described in this patent application could be applied in various electronic devices where efficient heat dissipation is crucial, such as:
- High-performance computers
- LED lighting systems
- Power electronics
- Automotive electronics
Problems Solved
This technology addresses the following issues:
- Overheating of semiconductor components
- Thermal management in electronic devices
- Ensuring reliability and longevity of electronic systems
Benefits
The benefits of this technology include:
- Improved performance and reliability of electronic devices
- Enhanced thermal management capabilities
- Extended lifespan of semiconductor components
Potential Commercial Applications
The semiconductor device with advanced heat dissipation capabilities could find applications in:
- Consumer electronics
- Industrial equipment
- Telecommunications devices
- Medical devices
Possible Prior Art
One possible prior art for this technology could be existing heat dissipation solutions for electronic devices, such as:
- Heat sinks
- Fans
- Liquid cooling systems
Unanswered Questions
How does the size of the cavity impact the heat dissipation efficiency of the device?
The abstract does not provide details on the dimensions of the cavity and its effect on heat dissipation performance.
What materials are used in the construction of the heat dissipation component?
The abstract does not mention the specific materials utilized in the heat dissipation component, which could influence its effectiveness and durability.
Original Abstract Submitted
A semiconductor device includes a substrate, a semiconductor component and a heat dissipation component. The semiconductor component is disposed on the substrate. The heat dissipation component is disposed on the substrate and having a cavity, an inlet and an outlet, wherein the inlet and the outlet communicate with the cavity.
