18099663. SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER LAYER simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER LAYER

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Jingu Kim of Suwon-si (KR)

Sangkyu Lee of Suwon-si (KR)

Yongkoon Lee of Suwon-si (KR)

Seokkyu Choi of Cheonan-si (KR)

SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER LAYER - A simplified explanation of the abstract

This abstract first appeared for US patent application 18099663 titled 'SEMICONDUCTOR PACKAGE INCLUDING HEAT SPREADER LAYER

Simplified Explanation

The patent application describes a semiconductor package that includes several layers for improved performance and heat dissipation. Here are the key points:

• The semiconductor package consists of a connection layer, a semiconductor chip, an adhesive layer, a heat spreader layer, and a lower redistribution layer.
• The semiconductor chip is placed in the center of the connection layer.
• An adhesive layer is applied on top of the semiconductor chip.
• A heat spreader layer is then placed on the adhesive layer.
• The width of the adhesive layer matches the width of the semiconductor chip.
• The width of the heat spreader layer is narrower than the adhesive layer.

Potential applications of this technology:

• This semiconductor package design can be used in various electronic devices, such as smartphones, tablets, laptops, and other consumer electronics.
• It can also be applied in industrial applications, including automotive electronics, aerospace systems, and medical devices.

Problems solved by this technology:

• The adhesive layer ensures a secure attachment of the semiconductor chip to the connection layer, preventing any potential damage or disconnection.
• The heat spreader layer helps dissipate heat generated by the semiconductor chip, preventing overheating and maintaining optimal performance.

Benefits of this technology:

• The semiconductor package design improves the overall performance and reliability of electronic devices.
• The heat spreader layer enhances heat dissipation, reducing the risk of overheating and extending the lifespan of the semiconductor chip.
• The secure attachment provided by the adhesive layer ensures the semiconductor chip remains in place, reducing the chances of damage or malfunction.

Original Abstract Submitted

A semiconductor package includes a connection layer, a semiconductor chip disposed at a center portion of the connection layer, an adhesive layer disposed on the semiconductor chip, a heat spreader layer disposed on the adhesive layer, and a lower redistribution layer disposed on the connection layer and a bottom surface of the semiconductor chip. A width of the adhesive layer is the same as a width of the semiconductor chip, and a width of the heat spreader layer is less than the width of the adhesive layer.