18098330. WAFER CLEANING APPARATUS, METHOD FOR CLEANING WAFER AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
- 1 WAFER CLEANING APPARATUS, METHOD FOR CLEANING WAFER AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 WAFER CLEANING APPARATUS, METHOD FOR CLEANING WAFER AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Original Abstract Submitted
WAFER CLEANING APPARATUS, METHOD FOR CLEANING WAFER AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
SeongKeun Cho of Suwon-si (KR)
Young Hoo Kim of Yongin-si (KR)
Seung Min Shin of Suwon-si (KR)
Tae Min Earmme of Hwaseong-si (KR)
WAFER CLEANING APPARATUS, METHOD FOR CLEANING WAFER AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18098330 titled 'WAFER CLEANING APPARATUS, METHOD FOR CLEANING WAFER AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
Simplified Explanation
The patent application describes a wafer cleaning apparatus and methods for cleaning wafers and fabricating semiconductor devices. The method involves using a laser to heat the wafer while supplying a chemical to clean its surface. The laser passes through an optical system with an aspheric lens array and a calibration window with different light transmissivities.
- The patent application describes a wafer cleaning apparatus and methods for cleaning wafers and fabricating semiconductor devices.
- The method involves using a laser to heat the wafer while supplying a chemical to clean its surface.
- The laser passes through an optical system with an aspheric lens array.
- The laser also passes through a calibration window with different light transmissivities.
- The calibration window has a first light projection window with two different regions.
- The first region is covered with a first coating layer, while the second region is covered with a second coating layer.
- The first and second coating layers have different light transmissivities.
Potential Applications
- Semiconductor manufacturing industry
- Wafer cleaning processes
Problems Solved
- Efficient and effective cleaning of wafers
- Precise control of laser heating and chemical cleaning processes
- Calibration of optical system for accurate laser penetration
Benefits
- Improved wafer cleaning results
- Enhanced control and accuracy in the fabrication of semiconductor devices
- Efficient calibration of the optical system for consistent laser penetration.
Original Abstract Submitted
A wafer cleaning apparatus, a method of cleaning wafer and a method of fabricating a semiconductor device are provided. The method of fabricating the semiconductor device includes disposing a wafer on a rotatable chuck, irradiating a lower surface of the wafer with a laser to heat the wafer, and supplying a chemical to an upper surface of the wafer to clean the wafer, wherein the laser penetrates an optical system including an aspheric lens array, the laser penetrates a calibration window, which includes a first window structure including a first light projection window including first and second regions different from each other, a first coating layer covering the first region of the first light projection window, and a second coating layer covering the second region of the first light projection window, and the first coating layer and the second coating layer have different light transmissivities from each other.
