18098158. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Myungsam Kang of Hwaseong-si (KR)
Jeongseok Kim of Cheonan-si (KR)
Kyung Don Mun of Hwaseong-si (KR)
Bongju Cho of Hwaseong-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18098158 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The semiconductor package described in this patent application includes a redistribution substrate with a dielectric layer and a wiring pattern. The wiring pattern consists of a horizontal line part and a via part connected to it. The via part has a narrower width than the line part.
A passivation layer made of a different material than the dielectric layer is present on the top surface of the redistribution substrate.
A conductive pillar passes through the passivation layer and is connected to the via part of the wiring pattern.
A connection terminal is located on the top surface of the conductive pillar. The distance between the top surface of the conductive pillar and the top surface of the passivation layer is greater than the thickness of the passivation layer.
- The semiconductor package includes a redistribution substrate with a unique wiring pattern and dielectric layer.
- The passivation layer on the top surface of the redistribution substrate is made of a different material, providing additional protection.
- The conductive pillar passing through the passivation layer allows for efficient electrical connections.
- The distance between the conductive pillar and the passivation layer provides sufficient space for proper functionality.
Potential Applications
This technology can be applied in various semiconductor devices and integrated circuits, including:
- Microprocessors
- Memory chips
- Power management circuits
- Communication devices
Problems Solved
The semiconductor package addresses several challenges in the field, including:
- Ensuring proper electrical connections between different components
- Protecting the wiring pattern and redistribution substrate from external factors
- Providing sufficient space for the conductive pillar without compromising the passivation layer
Benefits
The benefits of this technology include:
- Improved reliability and performance of semiconductor devices
- Enhanced protection against external factors such as moisture and contaminants
- Efficient electrical connections for optimal functionality
Original Abstract Submitted
A semiconductor package includes a redistribution substrate having a dielectric layer and a wiring pattern in the dielectric layer, the wiring pattern including a line part that extends horizontally, and a via part connected to the line part, the via part having a width less than a width of the line part, a passivation layer on a top surface of the redistribution substrate, the passivation layer including a material different from a material of the dielectric layer, a conductive pillar that penetrates the passivation layer, the conductive pillar being connected to the via part, and a connection terminal on a top surface of the conductive pillar, a distance between the top surface of the conductive pillar and a top surface of the passivation layer being greater than a thickness of the passivation layer.
