18097786. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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SEMICONDUCTOR PACKAGE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Kyongsoon Cho of Incheon (KR)

SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18097786 titled 'SEMICONDUCTOR PACKAGE

Simplified Explanation

The abstract describes a semiconductor package that includes a semiconductor chip with photoelectric conversion elements, a transparent member, and a spacer. The spacer is positioned between the chip and the transparent member and is horizontally spaced apart from the active array region of the chip. The spacer includes a supporter, a first adhesive pattern between the chip and the supporter, and a second adhesive pattern between the transparent member and the supporter. The spacer protrudes from the lateral surface of the chip and is offset from the chip's lateral surface.

  • The semiconductor package includes a semiconductor chip with photoelectric conversion elements.
  • A transparent member is placed on top of the chip.
  • A spacer is positioned between the chip and the transparent member.
  • The spacer includes a supporter that extends from the chip towards the transparent member.
  • A first adhesive pattern is between the chip and the supporter.
  • A second adhesive pattern is between the transparent member and the supporter.
  • The spacer protrudes from the lateral surface of the chip.
  • The lateral surface of the spacer is offset from the lateral surface of the chip.

Potential Applications

  • This semiconductor package can be used in various electronic devices that require photoelectric conversion, such as cameras, image sensors, and solar panels.

Problems Solved

  • The spacer in this semiconductor package helps to maintain a precise distance between the chip and the transparent member, ensuring proper functioning of the photoelectric conversion elements.
  • The offset lateral surface of the spacer helps to prevent any interference or damage to the chip during assembly or operation.

Benefits

  • The use of a spacer in this semiconductor package provides stability and protection to the photoelectric conversion elements on the chip.
  • The offset lateral surface of the spacer helps to prevent any potential damage to the chip, ensuring its longevity and reliability.
  • The precise distance maintained by the spacer ensures optimal performance of the photoelectric conversion elements, resulting in high-quality output.


Original Abstract Submitted

A semiconductor package is provided. The package includes a semiconductor chip that includes photoelectric conversion elements provided on an active array region of the semiconductor chip; a transparent member on the semiconductor chip; and a spacer between the semiconductor chip and the transparent member, and horizontally spaced apart from the active array region. The spacer includes: a supporter that extends from a top surface of the semiconductor chip toward a bottom surface of the transparent member; a first adhesive pattern that is between the semiconductor chip and a bottom surface of the supporter; and a second adhesive pattern that is between the transparent member a top surface of the supporter. The spacer protrudes from a lateral surface of the semiconductor chip, and a lateral surface of the spacer is offset from the lateral surface of the semiconductor chip.

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