18094794. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
SEUNGHOON Yeon of Suwon-si (KR)
YONGHOE Cho of Cheonan-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18094794 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The patent application describes a semiconductor package that includes a redistribution substrate, a semiconductor chip, and a conductive terminal. The redistribution substrate has multiple layers and patterns that facilitate the electrical connection between the chip and the terminal.
- The semiconductor package includes a redistribution substrate, a semiconductor chip, and a conductive terminal.
- The redistribution substrate consists of multiple layers, including dielectric layers and redistribution patterns.
- The chip pad on the semiconductor chip is electrically connected to the redistribution substrate.
- The first redistribution pattern on the redistribution substrate connects the chip pad to the second redistribution pattern.
- The first insulative pattern on the redistribution substrate has two surfaces, with the first surface in contact with the first redistribution pattern and the second surface in contact with the second redistribution pattern.
- The width of the first insulative pattern at the first surface is the same as or greater than the width at the second surface.
Potential applications of this technology:
- Semiconductor packaging industry
- Electronics manufacturing
Problems solved by this technology:
- Facilitates the electrical connection between the semiconductor chip and the conductive terminal
- Provides a reliable and efficient method for redistribution of signals
Benefits of this technology:
- Improved performance and reliability of semiconductor packages
- Enhanced signal transmission and connectivity
Original Abstract Submitted
Disclosed is a semiconductor package comprising a redistribution substrate, a semiconductor chip on the redistribution substrate and including a chip pad electrically connected to the redistribution substrate, and a conductive terminal on the redistribution substrate. The redistribution substrate includes a first dielectric layer, a first redistribution pattern, a second dielectric layer, a second redistribution pattern, and a first insulative pattern. The first redistribution pattern electrically connects the chip pad and the second redistribution pattern. The first insulative pattern has a first surface in contact with the first redistribution pattern and a second surface in contact with the second redistribution pattern. The second surface is opposite to the first surface. A width at the first surface of the first insulative pattern is the same as or greater than a width at the second surface of the first insulative pattern.
