18094597. FIELD-EFFECT TRANSISTOR STRUCTURE INCLUDING PASSIVE DEVICE AND BACK SIDE POWER DISTRIBUTION NETWORK (BSPDN) simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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FIELD-EFFECT TRANSISTOR STRUCTURE INCLUDING PASSIVE DEVICE AND BACK SIDE POWER DISTRIBUTION NETWORK (BSPDN)

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Jaehong Lee of Latham NY (US)

Seungchan Yun of Waterford NY (US)

Sooyoung Park of Clifton Park NY (US)

Kang-ill Seo of Springfield VA (US)

FIELD-EFFECT TRANSISTOR STRUCTURE INCLUDING PASSIVE DEVICE AND BACK SIDE POWER DISTRIBUTION NETWORK (BSPDN) - A simplified explanation of the abstract

This abstract first appeared for US patent application 18094597 titled 'FIELD-EFFECT TRANSISTOR STRUCTURE INCLUDING PASSIVE DEVICE AND BACK SIDE POWER DISTRIBUTION NETWORK (BSPDN)

Simplified Explanation

The patent application describes a field-effect transistor structure that includes various doped regions on a substrate, forming a sequentially connected passive device.

  • The structure includes a substrate with at least one doped region, a doped region on one side, and another doped region on the other side of the first doped region.
  • There is a channel structure on one side of the substrate, including a doped region on the second doped region.
  • On the other side of the channel structure, there is another channel structure including a doped region on the third doped region in the substrate.
  • The doped regions (4, 2, 1, 3, and 5) are connected in sequence to form the passive device.

Potential applications of this technology:

  • Integrated circuits
  • Electronics manufacturing
  • Semiconductor devices

Problems solved by this technology:

  • Improved performance and functionality of field-effect transistors
  • Enhanced integration of passive devices in semiconductor structures

Benefits of this technology:

  • Increased efficiency and reliability of electronic devices
  • Simplified manufacturing processes
  • Enhanced functionality and performance of integrated circuits.


Original Abstract Submitted

Provided is field-effect transistor structure including: a substrate including therein at least one 1doped region, a 2doped region on one side of the 1doped region, and a 3doped region on another side of the 1doped region; a 1channel structure including therein a 4doped region on the 2doped region in the substrate; and a 2channel structure, at a side of the 1channel structure, including therein a 5doped region on the 3doped region in the substrate, wherein the 4, 2, 1, 3and 5doped regions form a sequentially connected passive device.