18092994. SEMICONDUCTOR PACKAGE HAVING PADS WITH STEPPED STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

From WikiPatents
Jump to navigation Jump to search

SEMICONDUCTOR PACKAGE HAVING PADS WITH STEPPED STRUCTURE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

MYUNG KEE Chung of HWASEONG-SI (KR)

HYUN SOO Chung of HWASEONG-SI (KR)

TAE WON Yoo of SEOUL (KR)

SEMICONDUCTOR PACKAGE HAVING PADS WITH STEPPED STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18092994 titled 'SEMICONDUCTOR PACKAGE HAVING PADS WITH STEPPED STRUCTURE

Simplified Explanation

The patent application describes a semiconductor package that includes multiple semiconductor chips stacked on top of each other.

  • The package consists of a first semiconductor chip, a second semiconductor chip placed on top of the first chip, and a third semiconductor chip placed on top of the second chip.
  • A first pad is located on the top surface of the second chip and has two parts - a wider first portion and a narrower second portion that protrudes vertically from the first portion.
  • On the bottom surface of the third chip, facing the top surface of the second chip, there is a second pad.
  • A solder ball is placed around the sidewall of the second portion of the first pad, creating a connection between the first pad and the second pad.

Potential applications of this technology:

  • This semiconductor package design can be used in various electronic devices, such as smartphones, tablets, and computers.
  • It can be utilized in high-performance computing systems, where multiple chips need to be stacked to achieve higher processing power.
  • The design can also be applied in automotive electronics, aerospace systems, and other industries that require compact and efficient semiconductor packaging.

Problems solved by this technology:

  • The stacked semiconductor chips require a reliable and efficient method of interconnecting them.
  • The design addresses the challenge of creating a secure connection between the first and second pads using a solder ball.
  • By providing a protruding second portion on the first pad, the design ensures a strong and stable connection between the pads.

Benefits of this technology:

  • The semiconductor package allows for compact and efficient stacking of multiple chips, saving space and enabling higher performance.
  • The design provides a reliable interconnection between the stacked chips, reducing the risk of connection failures.
  • The use of solder balls enhances the electrical and thermal conductivity between the pads, improving overall performance and reliability.


Original Abstract Submitted

A semiconductor package including a first semiconductor chip, a second semiconductor chip disposed on the first semiconductor chip, and a third semiconductor chip disposed on the second semiconductor chip. A first pad is disposed on a top surface of the second semiconductor chip, and includes a first portion and a second portion protruding in a vertical direction from the first portion. A width of the first portion in a first horizontal direction is greater than a width of the second portion in the first horizontal direction. A second pad is disposed on a bottom surface of the third semiconductor chip facing the top surface of the second semiconductor chip, and a solder ball is disposed as surrounding a sidewall of the second portion of the first pad between the first pad and the second pad.

Retrieved from "http://wikipatents.org/index.php?title=18092994._SEMICONDUCTOR_PACKAGE_HAVING_PADS_WITH_STEPPED_STRUCTURE_simplified_abstract_(SAMSUNG_ELECTRONICS_CO.,_LTD.)&oldid=24470"