18090412. CIRCUIT BOARD AND DISPLAY DEVICE INCLUDING THE SAME simplified abstract (Samsung Display Co., Ltd.)
Contents
CIRCUIT BOARD AND DISPLAY DEVICE INCLUDING THE SAME
Organization Name
Inventor(s)
CIRCUIT BOARD AND DISPLAY DEVICE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18090412 titled 'CIRCUIT BOARD AND DISPLAY DEVICE INCLUDING THE SAME
Simplified Explanation
The patent application describes a circuit board with specific features and arrangements of connection pads and a driving chip.
- The circuit board has first and second connection pads arranged in a specific direction.
- The second connection pads are spaced apart from the first connection pads in a perpendicular direction.
- A driving chip is placed on the board between the first and second connection pads.
- Each first connection pad consists of three conductive layers, with the second and third layers overlapping the first layer.
Potential applications of this technology:
- Electronics manufacturing industry
- Consumer electronics
- Telecommunications
- Automotive industry
Problems solved by this technology:
- Improved circuit board design and layout
- Enhanced connectivity and signal transmission
- Efficient use of space on the board
Benefits of this technology:
- Increased functionality and performance of electronic devices
- Enhanced reliability and durability of circuit boards
- Simplified manufacturing processes
Original Abstract Submitted
A circuit board includes a board, first connection pads disposed on the board and arranged in a first direction, second connection pads disposed on the board and arranged in the first direction, the second connection pads spaced apart from the first connection pads in a second direction perpendicular to the first direction, and a driving chip disposed on the board between the first connection pads and the second connection pads. Each of the first connection pads includes a first conductive layer disposed on the board, a second conductive layer which entirely overlaps with the first conductive layer in a plan view, is disposed on the first conductive layer and is formed of a different material from that of the first conductive layer, and a third conductive layer entirely overlapping with the second conductive layer and disposed on the second conductive layer.
