18085859. FAN-OUT TYPE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
FAN-OUT TYPE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
Sangsick Park of Suwon-si (KR)
Hyoungjoo Lee of Suwon-si (KR)
FAN-OUT TYPE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18085859 titled 'FAN-OUT TYPE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The abstract describes a fan-out type semiconductor package that includes a package substrate, an interposer, conductive bumps, a semiconductor chip, a molding member, and a metal pillar structure.
- The package substrate is the base of the semiconductor package.
- The interposer is placed on the upper surface of the package substrate and has upper pads and lower pads that are electrically connected.
- Conductive bumps are used to connect the package substrate with the lower pads of the interposer.
- A semiconductor chip is positioned on the central portion of the interposer's upper surface and is electrically connected with the upper pads of the interposer.
- A molding member is located on the edge portion of the interposer's upper surface, with its upper surface being coplanar with the semiconductor chip's upper surface.
- A metal pillar structure extends vertically from the molding member's upper surface to the interposer's lower surface and is designed to individually make contact with the lower pads of the interposer.
Potential Applications
- This fan-out type semiconductor package can be used in various electronic devices, such as smartphones, tablets, and laptops.
- It can also be applied in automotive electronics, medical devices, and other industries that require high-performance and compact semiconductor packaging.
Problems Solved
- The fan-out type semiconductor package solves the problem of limited space in electronic devices by providing a compact and efficient packaging solution.
- It also addresses the need for reliable electrical connections between different components of the semiconductor package.
Benefits
- The use of a fan-out type semiconductor package allows for a higher density of components, leading to increased functionality and performance in electronic devices.
- The metal pillar structure provides individual contact points, ensuring reliable electrical connections.
- The compact design of the package helps in reducing the overall size and weight of electronic devices.
Original Abstract Submitted
A fan-out type semiconductor package is provided and may include: a package substrate; an interposer on an upper surface of the package substrate, the interposer including upper pads and lower pads electrically connected with the upper pads; conductive bumps between the package substrate and the lower pads of the interposer and electrically connecting the package substrate with the interposer; a semiconductor chip on a central portion of an upper surface of the interposer and electrically connected with the upper pads of the interposer; a molding member on an edge portion of the upper surface of the interposer, the molding member including an upper surface coplanar with an upper surface of the semiconductor chip; and a metal pillar structure vertically extending from the upper surface of the molding member to a lower surface of the interposer and configured to individually make contact with the lower pads of the interposer.
