18081102. WAFER TYPE SENSOR, WAFER ALIGNMENT METHOD USING THE SAME, AND CALIBRATION DEVICE FOR CALIBRATING WAFER TYPE SENSOR simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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WAFER TYPE SENSOR, WAFER ALIGNMENT METHOD USING THE SAME, AND CALIBRATION DEVICE FOR CALIBRATING WAFER TYPE SENSOR

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Byung Hoon Ko of Suwon-si (KR)

Seung Woo Noh of Suwon-si (KR)

Sang Yun Park of Suwon-si (KR)

Jin Woo Choi of Suwon-si (KR)

Youn Ho Kim of Suwon-si (KR)

WAFER TYPE SENSOR, WAFER ALIGNMENT METHOD USING THE SAME, AND CALIBRATION DEVICE FOR CALIBRATING WAFER TYPE SENSOR - A simplified explanation of the abstract

This abstract first appeared for US patent application 18081102 titled 'WAFER TYPE SENSOR, WAFER ALIGNMENT METHOD USING THE SAME, AND CALIBRATION DEVICE FOR CALIBRATING WAFER TYPE SENSOR

Simplified Explanation

The abstract describes a wafer-type sensor for wafer alignment, which includes a dummy wafer, a sensor module placed in the dummy wafer, and a processor that controls the sensor module to measure the distance between a side surface of the dummy wafer and a ring formed around the periphery of an electrostatic chuck. The measurement is based on the dummy wafer being mounted on the electrostatic chuck by a transfer robot.

  • The sensor is designed for wafer alignment.
  • It includes a dummy wafer, a sensor module, and a processor.
  • The sensor module is placed inside the dummy wafer.
  • The processor controls the sensor module to measure the distance between the dummy wafer and a ring around the electrostatic chuck.
  • The measurement is based on the dummy wafer being mounted on the electrostatic chuck by a transfer robot.

Potential Applications:

  • Semiconductor manufacturing: The wafer-type sensor can be used in semiconductor manufacturing processes to ensure accurate alignment of wafers, improving the quality and yield of semiconductor devices.
  • Nanotechnology: The sensor can be utilized in nanotechnology applications where precise alignment of wafers is crucial for the fabrication of nanoscale devices.

Problems Solved:

  • Alignment accuracy: The wafer-type sensor solves the problem of accurately aligning wafers by providing a measurement of the distance between the dummy wafer and the ring around the electrostatic chuck.
  • Process optimization: By ensuring precise alignment, the sensor helps optimize manufacturing processes, reducing errors and improving overall efficiency.

Benefits:

  • Improved yield: Accurate wafer alignment leads to improved yield in semiconductor manufacturing, reducing the number of defective devices and increasing overall productivity.
  • Cost savings: The sensor helps minimize errors and optimize processes, resulting in cost savings by reducing material waste and improving operational efficiency.
  • Enhanced quality control: The wafer-type sensor enables better quality control by ensuring accurate alignment, leading to higher quality semiconductor devices.


Original Abstract Submitted

A wafer-type sensor for wafer alignment includes a dummy wafer; a sensor module disposed in the dummy wafer, and a processor configured to control the sensor module to measure a distance between a side surface of the dummy wafer and a ring formed around a periphery of an electrostatic chuck based on the dummy wafer being mounted on the electrostatic chuck by a transfer robot.

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