18078249. MOUNTING DEVICE AND MOUNTING METHOD simplified abstract (Samsung Electronics Co., Ltd.)

MOUNTING DEVICE AND MOUNTING METHOD

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

Daisuke Nagatomo of Yokohama (JP)

Fumitaka Moroishi of Yokohama (JP)

Masanori Izumita of Yokohama (JP)

Shinji Ueyama of Yokohama (JP)

Takahiro Tokumiya of Yokohama (JP)

Takamasa Sugiura of Yokohama (JP)

Tatsuya Ishimoto of Yokohama (JP)

Masato Kajinami of Yokohama (JP)

MOUNTING DEVICE AND MOUNTING METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18078249 titled 'MOUNTING DEVICE AND MOUNTING METHOD

Abstract

A mounting device is described in this patent application. The device consists of a bonding head that holds a first object, a bonding stage that holds a second object, and a dual-field-of-view optical system with an image sensor. The optical system captures images of alignment marks on both objects simultaneously to obtain a first image. The relative position between the objects can be adjusted based on this image, and the first object can be bonded to the second object.

Patent/Innovation Explanation

• The mounting device includes a bonding head and a bonding stage.
• A dual-field-of-view optical system with an image sensor is used to capture images of alignment marks on both objects.
• The images are captured simultaneously to obtain a first image.
• The relative position between the objects can be adjusted based on the first image.
• The first object can then be bonded to the second object.

Potential Applications

• This technology can be used in manufacturing processes that require precise alignment and bonding of objects.
• It can be applied in the production of electronic devices, such as circuit boards, where accurate positioning and bonding are crucial.
• The mounting device can also be used in the assembly of optical components, ensuring precise alignment and bonding for optimal performance.

Problems Solved

• The mounting device solves the problem of accurately aligning and bonding objects in manufacturing processes.
• It eliminates the need for manual alignment, reducing human error and increasing efficiency.
• The dual-field-of-view optical system allows for simultaneous capture of alignment marks, improving the accuracy and speed of the alignment process.

Benefits

• The device improves the precision and accuracy of object alignment and bonding.
• It reduces the time and effort required for manual alignment, increasing productivity.
• The use of the dual-field-of-view optical system enables faster and more efficient alignment, leading to cost savings in manufacturing processes.

Original Abstract Submitted

A mounting device includes: a bonding head configured to hold a first object, a bonding stage configured to hold a second object, and a dual-field-of-view (FOV) optical system including an image sensor configured to simultaneously capture an image of a first alignment mark on the first object and an image of a second alignment mark on the second object to obtain a first image. At least one of the bonding head and the bonding stage is configured to adjust a relative position between the first object and the second object based on the first image, and bond the first object to the second object.