18075814. DIE ALIGNMENT METHOD USING MAGNETIC FORCE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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DIE ALIGNMENT METHOD USING MAGNETIC FORCE

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Sumin Kim of Hwaseong-si (KR)

Minwoo Rhee of Seoul (KR)

Yongchul Shin of Hwaseong-si (KR)

Ilyoung Han of Uiwang-si (KR)

Nungpyo Hong of Goyang-si (KR)

Seungdon Lee of Seongnam-si (KR)

Kyeongbin Lim of Seoul (KR)

DIE ALIGNMENT METHOD USING MAGNETIC FORCE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18075814 titled 'DIE ALIGNMENT METHOD USING MAGNETIC FORCE

Simplified Explanation

Abstract: A die alignment method is described in this patent application. The method involves aligning two dies, each containing magnetic patterns, using magnetic force. The magnetic patterns in both dies are made of horizontally magnetically anisotropic material. Importantly, the magnetic patterns do not overlap vertically when the two dies are aligned.

Patent/Innovation Explanation:

  • The patent describes a method for aligning two dies using magnetic force.
  • The first die and the second die both contain magnetic patterns.
  • The magnetic patterns in both dies are made of horizontally magnetically anisotropic material.
  • The alignment is achieved by utilizing the magnetic force between the first and second magnetic patterns.
  • It is crucial that the magnetic patterns do not overlap vertically when the two dies are aligned.

Potential Applications:

  • Semiconductor manufacturing: This method can be used in the production of integrated circuits, where precise alignment of multiple dies is required.
  • Microelectronics assembly: The method can be applied in the assembly of microelectronic components, ensuring accurate alignment between different parts.
  • Optoelectronics manufacturing: The technique can be utilized in the production of optoelectronic devices, where precise alignment of multiple dies is necessary.

Problems Solved:

  • Precise alignment: The method solves the problem of aligning multiple dies accurately, ensuring proper functioning of the final product.
  • Efficiency: The use of magnetic force for alignment simplifies the process and reduces the time required for alignment.
  • Avoiding overlap: The method ensures that the magnetic patterns in the two dies do not vertically overlap, preventing any interference or malfunction.

Benefits:

  • Improved manufacturing yield: Accurate alignment of dies leads to higher manufacturing yield and reduces the number of defective products.
  • Cost-effective: The simplified alignment process reduces production costs by saving time and resources.
  • Enhanced product performance: Proper alignment ensures optimal functionality and performance of the final product.


Original Abstract Submitted

A die alignment method includes vertically aligning a first die comprising first magnetic patterns and a second die comprising second magnetic patterns with each other using magnetic force between the first magnetic patterns and the second magnetic patterns. Each of the first magnetic patterns and the second magnetic patterns comprises a horizontally magnetically anisotropic material. The first magnetic patterns and the second magnetic patterns do not vertically overlap each other when the first die and the second die are vertically aligned with each other.