18074134. SEMICONDUCTOR DEVICE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
ATSUSHI Fujisaki of SUWON-SI (KR)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18074134 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation
The patent application describes a semiconductor package design that includes various layers and structures to enhance the performance and reliability of the semiconductor chip.
- The semiconductor package consists of a semiconductor chip, a redistribution layer structure, a bump pad, a metal seed layer, an insulating layer, and a bump structure.
- The redistribution layer structure is positioned beneath the semiconductor chip, while the bump pad is located beneath the redistribution layer structure.
- The bump pad has an upper structure with a wider width and a lower structure with a narrower width.
- A metal seed layer is present on the lower surface of the upper structure and the side surface of the lower structure.
- The insulating layer surrounds both the redistribution layer structure and the bump pad.
- The bump structure is positioned beneath the bump pad.
- The metal seed layer has undercuts at both ends where it contacts the upper and lower structures of the bump pad.
Potential applications of this technology:
- Semiconductor packaging for various electronic devices such as smartphones, tablets, computers, etc.
- High-performance computing systems.
- Automotive electronics.
- Internet of Things (IoT) devices.
- Medical devices.
Problems solved by this technology:
- Improved performance and reliability of the semiconductor chip.
- Enhanced electrical connectivity between different layers and structures.
- Minimized risk of short circuits or other electrical issues.
- Better thermal management.
Benefits of this technology:
- Higher efficiency and functionality of electronic devices.
- Increased durability and lifespan of semiconductor packages.
- Improved signal transmission and reduced signal loss.
- Enhanced thermal dissipation capabilities.
Original Abstract Submitted
A semiconductor package including a semiconductor chip, a redistribution layer structure disposed under the semiconductor chip, a bump pad disposed under the redistribution layer structure and having an upper structure of a first width and a lower structure of a second width less than the first width, a metal seed layer disposed along a lower surface of the upper structure and a side surface of the lower structure, an insulating layer surrounding the redistribution layer structure and the bump pad, and a bump structure disposed under the bump pad. A first undercut is disposed at one end of the metal seed layer that contacts the upper structure, and a second undercut is disposed at an other end of the metal seed layer that contacts the lower structure.
