18064241. SEMICONDUCTOR PACKAGE INCLUDING A BARRIER STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)
SEMICONDUCTOR PACKAGE INCLUDING A BARRIER STRUCTURE
Organization Name
Inventor(s)
CHANGEUN Joo of CHEONAN-SI (KR)
EUNKYOUNG Choi of HWASEONG-SI (KR)
SEMICONDUCTOR PACKAGE INCLUDING A BARRIER STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18064241 titled 'SEMICONDUCTOR PACKAGE INCLUDING A BARRIER STRUCTURE
Simplified Explanation
The abstract describes a semiconductor package that includes two semiconductor chips connected by connection bumps and an adhesive layer. The adhesive layer surrounds the connection bumps and includes a protruding portion. A barrier structure covers a portion of the first connection pads and overlaps the second semiconductor chip, contacting the protruding portion of the adhesive layer.
- The semiconductor package includes two semiconductor chips connected by connection bumps and an adhesive layer.
- The adhesive layer surrounds the connection bumps and includes a protruding portion.
- A barrier structure covers a portion of the first connection pads and overlaps the second semiconductor chip.
- The barrier structure contacts the protruding portion of the adhesive layer.
Potential Applications
- This technology can be used in various electronic devices that require reliable and compact semiconductor packaging.
- It can be applied in mobile phones, tablets, laptops, and other consumer electronics.
- It can also be used in automotive electronics, medical devices, and industrial equipment.
Problems Solved
- The semiconductor package solves the problem of securely connecting two semiconductor chips while providing protection and insulation.
- It addresses the challenge of maintaining reliable electrical connections between the chips in a compact package.
- The barrier structure helps prevent damage to the connection bumps and enhances the overall durability of the package.
Benefits
- The semiconductor package offers improved reliability and performance compared to traditional packaging methods.
- It allows for a more compact design, enabling smaller and thinner electronic devices.
- The barrier structure provides additional protection against external factors such as moisture, dust, and mechanical stress.
Original Abstract Submitted
A semiconductor package includes a first semiconductor chip having a first surface and a second surface. First connection pads are adjacent to the first surface. A second semiconductor chip has a lower surface facing the first surface of the first semiconductor chip and includes second connection pads, Connection bumps contact the first connection pads and the second connection pads between the first semiconductor chip and the second semiconductor chip. An adhesive layer is interposed between the first semiconductor chip and the second semiconductor chip to at least partially surround the connection bumps. The adhesive layer includes a protruding portion protruding from a side surface of the second semiconductor chip. A barrier structure covers a portion of the first connection pads, partially overlapping the second semiconductor chip on the first surface, and contacting the protruding portion of the adhesive layer.
