18063029. APPARATUS AND METHOD OF MANUFACTURING SOLDER BUMP simplified abstract (Samsung Electronics Co., Ltd.)
APPARATUS AND METHOD OF MANUFACTURING SOLDER BUMP
Organization Name
Inventor(s)
Sungyong Yun of Hwaseong-si (KR)
Sanghoon Lee of Seongnam-si (KR)
Sungil Lee of Hwaseong-si (KR)
APPARATUS AND METHOD OF MANUFACTURING SOLDER BUMP - A simplified explanation of the abstract
This abstract first appeared for US patent application 18063029 titled 'APPARATUS AND METHOD OF MANUFACTURING SOLDER BUMP
Simplified Explanation
The abstract describes an apparatus for forming a solder bump on a substrate. It includes a supporter to hold the substrate, a housing surrounding the supporter, and a cover that creates a manufacturing space with the housing. The manufacturing space has an edge heating zone along its perimeter, and there is an oxide remover supply nozzle to provide an oxide remover to the manufacturing space.
- The apparatus is designed to form a solder bump on a substrate.
- It includes a supporter to hold the substrate securely.
- The housing surrounds the supporter to provide a controlled environment.
- The cover creates a manufacturing space with the housing.
- The manufacturing space has an edge heating zone to facilitate the solder bump formation.
- An oxide remover supply nozzle is used to supply an oxide remover to the manufacturing space.
Potential Applications
- Electronics manufacturing
- Semiconductor packaging
- Circuit board assembly
Problems Solved
- Ensures secure and precise formation of solder bumps on substrates
- Provides a controlled environment for the solder bump formation process
- Removes oxide from the manufacturing space to improve soldering quality
Benefits
- Improved solder bump formation accuracy and reliability
- Enhanced control over the soldering process
- Reduced risk of defects due to oxide presence
Original Abstract Submitted
An apparatus for forming a solder bump on a substrate including a supporter configured to support the substrate to be provided thereon, a housing surrounding the supporter, a cover defining a manufacturing space in combination with the housing and including an edge heating zone along a perimeter thereof, the manufacturing space surrounding the supporter, and an oxide remover supply nozzle configured to supply an oxide remover to the manufacturing space may be provided.
