18062830. CHIP PEELING APPARATUS AND CHIP PEELING METHOD USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
CHIP PEELING APPARATUS AND CHIP PEELING METHOD USING THE SAME
Organization Name
Inventor(s)
Tatsuya Ishimoto of Yokohama (JP)
Naoyuki Takada of Yokohama (JP)
Takahiro Tokumiya of Yokohama (JP)
Masato Kajinami of Yokohama (JP)
CHIP PEELING APPARATUS AND CHIP PEELING METHOD USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18062830 titled 'CHIP PEELING APPARATUS AND CHIP PEELING METHOD USING THE SAME
Simplified Explanation
The abstract describes a chip peeling apparatus that includes a peeling device with vacuum adsorption holes and air blow holes. The device is designed to peel a chip off a tape by applying vacuum pressure to adsorb the device to the tape and directing air blow to the region of the tape.
- The peeling device has vacuum adsorption holes and air blow holes.
- It is placed below the chip on the tape to peel it off.
- Vacuum pressure is applied through the adsorption holes to attach the device to the tape.
- Air blow is directed through the air blow holes to facilitate the peeling process.
Potential Applications
- Semiconductor manufacturing: This apparatus can be used in the production of semiconductor chips to efficiently peel them off the tape.
- Electronics assembly: It can be utilized in the assembly of electronic components to remove chips from tapes.
- Packaging industry: The apparatus can be employed in packaging processes to separate chips from tapes before further processing.
Problems Solved
- Efficient chip peeling: The apparatus provides a method for quickly and effectively peeling chips off tapes.
- Automation: It allows for automated chip peeling, reducing the need for manual labor.
- Damage prevention: The vacuum adsorption and air blow mechanism helps prevent damage to the chips during the peeling process.
Benefits
- Time-saving: The apparatus enables fast chip peeling, increasing productivity.
- Cost-effective: Automation reduces the need for manual labor, resulting in cost savings.
- Improved quality: The vacuum adsorption and air blow mechanism minimize the risk of chip damage, ensuring high-quality products.
Original Abstract Submitted
A chip peeling apparatus may include a peeling device. The peeling device may include a plurality of vacuum adsorption holes and a plurality of first air blow holes arranged around the plurality of vacuum adsorption holes. The peeling device may be configured to peel a chip off a tape when the peeling device is arranged below a region of the tape on which the chip is attached, vacuum pressure is applied through the plurality of vacuum adsorption holes to adsorb the peeling device to the region of the tape, and a first air blow is directed through the plurality of first air blow holes to the region of the tape.
