18061008. SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Organization Name
Inventor(s)
Eunseok Song of Hwaseong-si (KR)
Kyung Suk Oh of Seongnam-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18061008 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Simplified Explanation
The abstract describes a semiconductor package that includes a substrate, a die stack, and connection terminals. The die stack consists of three dies, with the second die being sandwiched between the first and third dies. The second die is in direct contact with either the first or third die.
- The semiconductor package includes a substrate, die stack, and connection terminals.
- The die stack consists of three dies: first die, second die, and third die.
- The first die has through electrodes that vertically penetrate it.
- The second die is placed on top of the first die and also has through electrodes.
- The third die is placed on top of the second die and has an active surface facing the substrate.
- The second die is in direct contact with either the first or third die.
Potential applications of this technology:
- Semiconductor manufacturing industry
- Electronics industry
- Integrated circuit design and production
Problems solved by this technology:
- Efficient vertical integration of multiple dies in a semiconductor package
- Improved electrical connectivity between the dies
- Enhanced performance and functionality of the semiconductor package
Benefits of this technology:
- Compact and space-saving design
- Improved electrical performance and signal transmission
- Increased functionality and versatility of the semiconductor package
Original Abstract Submitted
A semiconductor package includes a substrate, a die stack on the substrate, and connection terminals between the substrate and the die stack. The die stack includes a first die having a first active surface facing the substrate, the first die including first through electrodes vertically penetrating the first die, a second die on the first die and having a second active surface, the second die including second through electrodes vertically penetrating the second die, and a third die on the second die and having a third active surface facing the substrate. The second active surface of the second die is in direct contact with one of the first or third active surfaces.
