18056954. SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)

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SEMICONDUCTOR DEVICE

Organization Name

Samsung Electronics Co., Ltd.

Inventor(s)

WOO BIN Song of HWASEONG-SI (KR)

SANG WOO Lee of SEOUL (KR)

MIN HEE Cho of SUWON-SI (KR)

SEMICONDUCTOR DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18056954 titled 'SEMICONDUCTOR DEVICE

Simplified Explanation

The abstract describes a semiconductor device that improves performance and reliability by using source/drain engineering in a transistor with an oxide semiconductor layer. Here are the key points:

  • The semiconductor device includes a substrate and a metal oxide layer on the substrate.
  • A source/drain pattern is in contact with the metal oxide layer, with a portion protruding from the top surface of the metal oxide layer.
  • Multiple gate structures are placed on the metal oxide layer, with the source/drain pattern in between. Each gate structure has gate spacers and an insulating material layer.
  • The insulating material layer is in contact with the metal oxide layer but does not extend along the top surface of the source/drain pattern.
  • A contact is placed on the source/drain pattern and is connected to it.

Potential applications of this technology:

  • Semiconductor manufacturing industry
  • Electronics industry
  • Integrated circuit design and production

Problems solved by this technology:

  • Enhances performance and reliability of the semiconductor device
  • Improves source/drain engineering in transistors with oxide semiconductor layers

Benefits of this technology:

  • Increased performance and reliability of the semiconductor device
  • Enhanced source/drain engineering for transistors with oxide semiconductor layers


Original Abstract Submitted

Aspects of the present inventive concept provide a semiconductor device capable of enhancing performance and reliability through source/drain engineering in a transistor including an oxide semiconductor layer. The semiconductor device includes a substrate, a metal oxide layer disposed on the substrate, a source/drain pattern being in contact with the metal oxide layer and including a portion protruding from a top surface of the metal oxide layer, a plurality of gate structures disposed on the metal oxide layer with the source/drain pattern interposed therebetween and each including gate spacers and an insulating material layer, the insulating material layer being in contact with the metal oxide layer, and not extending along a top surface of the source/drain pattern, and a contact disposed on the source/drain pattern, the contact being connected to the source/drain pattern.