18055357. METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
Organization Name
Inventor(s)
Yeonga Kim of Hwaseong-si (KR)
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18055357 titled 'METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
Simplified Explanation
The patent application describes a method of manufacturing a semiconductor device using a light-blocking film and a photosensitive adhesive layer. Here are the key points:
- A light-blocking film is formed on the edge region of a light-transmitting carrier substrate to block specific wavelengths of light.
- A photosensitive adhesive layer is applied on the upper surface of the carrier substrate, covering the light-blocking film.
- A product substrate is bonded to the carrier substrate using the photosensitive adhesive layer.
- The photosensitive adhesive layer is partially cured by exposing it to light through the carrier substrate, except for the portion overlapping the light-blocking film.
- The product substrate is processed to form multiple semiconductor devices after the partial curing of the adhesive layer.
- The product substrate is then cut into separate individual semiconductor devices.
Potential applications of this technology:
- Manufacturing of various types of semiconductor devices, such as integrated circuits, transistors, and diodes.
- Production of high-performance electronic components used in computers, smartphones, and other electronic devices.
Problems solved by this technology:
- The light-blocking film helps prevent unwanted light from affecting the performance of the semiconductor devices.
- The photosensitive adhesive layer allows for easy bonding of the product substrate to the carrier substrate, ensuring proper alignment and stability during subsequent processing steps.
Benefits of this technology:
- Improved device performance by blocking specific wavelengths of light that could interfere with the semiconductor operation.
- Simplified manufacturing process with the use of a photosensitive adhesive layer for bonding and alignment.
- Increased yield and efficiency by cutting the product substrate into separate individual semiconductor devices.
Original Abstract Submitted
A method of manufacturing a semiconductor device includes forming a light blocking film configured to block first light within a first wavelength band on an edge region of an upper surface of a light-transmitting carrier substrate; forming a photosensitive adhesive layer on the upper surface of the light-transmitting carrier substrate to at least partially cover the light blocking film; bonding a product substrate to the upper surface of the light-transmitting carrier substrate using the photosensitive adhesive layer; partially curing the photosensitive adhesive layer by irradiating the light through the light-transmitting carrier substrate, wherein a portion of the photosensitive adhesive layer overlapping the light blocking film is not cured; processing the product substrate to form a plurality of semiconductor devices after the partially curing of the photosensitive adhesive layer; and cutting the product substrate such that the plurality of semiconductor devices are cut into a plurality of separate individual semiconductor devices.
