18053806. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Changbo Lee of Hwaseong-si (KR)
Youngmin Kim of Cheonan-si (KR)
Hyundong Lee of Cheonan-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18053806 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation
The abstract describes a semiconductor package that includes a redistribution structure, a semiconductor chip, a connection pad, a connection bump, a molding layer, and a wetting layer.
- The semiconductor package includes multiple redistribution layers and vias.
- A semiconductor chip is mounted on the redistribution structure.
- A connection pad is present between the redistribution structure and the chip and is connected to the redistribution structure.
- A connection bump is used to connect the connection pad and the chip pad.
- A molding layer surrounds the redistribution structure and the chip.
- A through electrode extends through the molding layer.
- A wetting layer is present between the redistribution structure and the molding layer.
Potential Applications
- This technology can be used in various electronic devices that require semiconductor packages, such as smartphones, tablets, and computers.
- It can be applied in the automotive industry for advanced driver-assistance systems (ADAS), infotainment systems, and other electronic components.
Problems Solved
- The semiconductor package provides improved connectivity and reliability between the redistribution structure, chip pad, and connection pad.
- The through electrode and wetting layer enhance the overall performance and stability of the package.
- The design allows for efficient integration of the semiconductor chip into electronic devices.
Benefits
- The redistribution structure and vias enable efficient routing of signals and power within the semiconductor package.
- The connection bump ensures a secure and reliable connection between the chip pad and the connection pad.
- The molding layer and wetting layer provide protection and stability to the semiconductor chip and the redistribution structure.
- The through electrode allows for additional connectivity options and integration with other components.
Original Abstract Submitted
A semiconductor package includes a first redistribution structure including a plurality of first redistribution layers and a plurality of first redistribution vias. A semiconductor chip is on the first redistribution structure. The semiconductor chip includes a chip pad. A connection pad is between the first redistribution structure and the semiconductor chip, and is connected to the first redistribution structure. A connection bump is connected to the connection pad and the chip pad. A molding layer extends around the first redistribution structure and the semiconductor chip, and a through electrode extends through the molding layer. A wetting layer is between the first redistribution structure and the molding layer.
