18053012. INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING SAME

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor(s)

Pochun Wang of Hsinchu (TW)

Ting-Wei Chiang of Hsinchu (TW)

Chih-Ming Lai of Hsinchu (TW)

Hui-Zhong Zhuang of Hsinchu (TW)

Jung-Chan Yang of Hsinchu (TW)

Ru-Gun Liu of Hsinchu (TW)

Ya-Chi Chou of Hsinchu (TW)

Yi-Hsiung Lin of Hsinchu (TW)

Yu-Xuan Huang of Hsinchu (TW)

Yu-Jung Chang of Hsinchu (TW)

Guo-Huei Wu of Hsinchu (TW)

Shih-Ming Chang of Hsinchu (TW)

INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18053012 titled 'INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING SAME

Simplified Explanation

The abstract describes an integrated circuit that includes multiple active regions, conductive structures, insulating regions, gates, and contacts. Here is a simplified explanation of the abstract:

• The integrated circuit has two active regions located on a substrate, extending in one direction, and separated from each other in another direction.
• A conductive structure is positioned between the two active regions, extending in the same direction as the active regions.
• An insulating region is located between the active regions and the conductive structure.
• A set of gates is present on a different level, extending in the direction perpendicular to the active regions, and overlapping the conductive structure.
• A set of contacts is also on the same level as the gates, extending in the same direction and overlapping the conductive structure.

Potential applications of this technology:

• Integrated circuits are used in various electronic devices such as smartphones, computers, and IoT devices.
• This technology can be applied in the development of more efficient and compact integrated circuits.
• It can enhance the performance and functionality of electronic devices.

Problems solved by this technology:

• The integration of multiple active regions, conductive structures, insulating regions, gates, and contacts allows for more complex circuit designs.
• The separation of active regions and the use of insulating regions prevent interference and improve circuit reliability.

Benefits of this technology:

• The compact design of the integrated circuit saves space and enables smaller electronic devices.
• The improved circuit design enhances the performance and functionality of electronic devices.
• The prevention of interference and improved reliability result in more stable and durable circuits.

Original Abstract Submitted

An integrated circuit includes a first and second active region, a first conductive structure, an insulating region, a set of gates and a set of contacts. The first and second active region are in a substrate, extend in a first direction, are located on a first level, and being separated from one another in a second direction. The first conductive structure extends in the first direction, is located on the first level, and is between the first and second active region. The insulating region is located on at least the first level, and is between the first and second active region and the first conductive structure. The set of gates extend in the second direction, overlap the first conductive structure, and is located on a second level. The set of contacts extend in the second direction, overlap the first conductive structure, and is located on the second level.