18050724. INTERPOSER STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
INTERPOSER STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Organization Name
Inventor(s)
Jeonghoon Ahn of Seongnam-si (KR)
INTERPOSER STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18050724 titled 'INTERPOSER STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Simplified Explanation
The abstract describes an interposer structure that includes several components such as an interposer substrate, through electrodes, redistribution structures, conductive posts, and insulating layers.
- The interposer structure consists of an interposer substrate, which serves as the base.
- Through electrodes are present in the interposer substrate, penetrating vertically through it.
- A redistribution structure is formed on the interposer substrate, comprising a redistribution pattern connected to the through electrodes and a redistribution insulating layer on the side surfaces of the redistribution pattern.
- A conductive post is placed on the redistribution structure and connected to the redistribution pattern.
- An interposer insulating layer is applied to the side surfaces of the conductive post on the redistribution structure.
Potential applications of this technology:
- Integrated circuit packaging: The interposer structure can be used in the packaging of integrated circuits, providing a reliable connection between the integrated circuit and other components.
- High-speed data transfer: The through electrodes and redistribution structures enable efficient and fast data transfer between different components in electronic devices.
Problems solved by this technology:
- Improved connectivity: The interposer structure ensures a strong and reliable connection between various components, reducing the risk of signal loss or failure.
- Space optimization: The vertical penetration of through electrodes allows for a more compact design, optimizing the use of space within electronic devices.
Benefits of this technology:
- Enhanced performance: The interposer structure enables high-speed data transfer, improving the overall performance of electronic devices.
- Compact design: The vertical through electrodes and redistribution structures help in creating a more compact and space-efficient design for electronic devices.
Original Abstract Submitted
An interposer structure includes: an interposer substrate; an interposer through electrode penetrating through the interposer substrate in a vertical direction; a redistribution structure on the interposer substrate and including a redistribution pattern connected to the interposer through electrode and a redistribution insulating layer on side surfaces of the redistribution pattern on the interposer substrate; a conductive post on the redistribution structure and connected to the redistribution pattern; and an interposer insulating layer on side surfaces of the conductive post on the redistribution structure.
