18049901. SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Jayeon Lee of Seongnam-si (KR)
Jaeeun Lee of Hwaseong-si (KR)
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18049901 titled 'SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
Simplified Explanation
The patent application describes a semiconductor device that consists of multiple semiconductor chips stacked on a substrate. An underfill layer is placed between the chips and the substrate, and a molding resin surrounds the chips. The resin also fills the space between the top chip and the one below it.
- The semiconductor device includes multiple stacked semiconductor chips on a substrate.
- An underfill layer is used to provide support and protection between the chips and the substrate.
- A molding resin is applied to encapsulate the chips and provide additional protection.
- The resin extends into the space between the top chip and the one below it, ensuring complete encapsulation.
Potential Applications
- This technology can be used in various electronic devices that require multiple semiconductor chips, such as smartphones, computers, and automotive electronics.
- It can be applied in high-performance computing systems, where multiple chips need to be stacked to achieve higher processing power.
- The semiconductor device can be used in IoT devices, wearable technology, and other small form factor devices where space is limited.
Problems Solved
- The underfill layer provides mechanical support and prevents stress and damage to the chips during thermal cycling and other environmental conditions.
- The molding resin encapsulates the chips, protecting them from moisture, dust, and other contaminants.
- By extending the resin into the space between the chips, the entire device is effectively sealed, reducing the risk of failure due to external factors.
Benefits
- The stacked design allows for increased functionality and performance in a compact form factor.
- The underfill layer and molding resin provide robust protection, increasing the reliability and lifespan of the semiconductor device.
- The complete encapsulation of the chips ensures better resistance to environmental factors, improving the overall quality and durability of the device.
Original Abstract Submitted
A semiconductor device includes a plurality of semiconductor chips sequentially stacked on a substrate, an underfill layer between the plurality of semiconductor chips and between the substrate and a lowermost one of the plurality of semiconductor chips, and a molding resin extending around the plurality of semiconductor chips. The molding resin extends to a space between an uppermost one of the plurality of semiconductor chips and a semiconductor chip sequentially beneath the uppermost one of the plurality of semiconductor chips.
