18048877. ISOLATION RAIL BETWEEN BACKSIDE POWER RAILS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

ISOLATION RAIL BETWEEN BACKSIDE POWER RAILS

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

Nicholas Anthony Lanzillo of Wynantskill NY (US)

Lawrence A. Clevenger of Saratoga Springs NY (US)

Hosadurga Shobha of Niskayuna NY (US)

Ruilong Xie of Niskayuna NY (US)

Baozhen Li of South Burlington VT (US)

ISOLATION RAIL BETWEEN BACKSIDE POWER RAILS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18048877 titled 'ISOLATION RAIL BETWEEN BACKSIDE POWER RAILS

Simplified Explanation

The semiconductor device described in the patent application includes a backside power rail, a backside ground rail, and a backside isolation rail between the backside power rail and the backside ground rail. The backside isolation rail provides electrical isolation between the power and ground rails, preventing electrical shorts.

• Backside power rail, ground rail, and isolation rail are key components of the semiconductor device.
• The backside isolation rail prevents electrical shorts between the power and ground rails.

Potential Applications

The technology described in the patent application could be applied in various semiconductor devices where close proximity of power and ground rails is required while maintaining electrical isolation.

Problems Solved

The technology solves the problem of potential electrical shorts between the power and ground rails in semiconductor devices.

Benefits

The benefits of this technology include improved efficiency and reliability of semiconductor devices by preventing electrical shorts and enabling closer placement of power and ground rails.

Potential Commercial Applications

The technology could be utilized in the manufacturing of integrated circuits, microprocessors, and other semiconductor devices to enhance performance and reliability.

Possible Prior Art

Prior art may include similar techniques used in semiconductor devices to provide electrical isolation between power and ground components.

How does the backside isolation rail provide electrical isolation between the power and ground rails in the semiconductor device?

The backside isolation rail is designed to have insulating properties that prevent the flow of electrical current between the power and ground rails, thereby maintaining isolation.

What are the specific materials used in the construction of the backside isolation rail to ensure effective electrical isolation?

The materials used in the backside isolation rail must have high insulating properties to prevent electrical conduction between the power and ground rails. Common materials may include silicon dioxide or other dielectric materials.

Original Abstract Submitted

A semiconductor device includes a backside power rail, a backside ground rail, and a backside isolation rail between the backside power rail and the backside ground rail. The backside isolation rail may provide adequate electrical isolation between the backside power rail and the backside ground rail, thereby enabling the backside power rail and the backside ground rail to be located relatively near to one another. The backside isolation rail may also cure actual electrical shorts between the backside power rail and the backside ground rail.