18039656. FOLDABLE ELECTRONIC DEVICE COMPRISING HEAT-DISSIPATING STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
FOLDABLE ELECTRONIC DEVICE COMPRISING HEAT-DISSIPATING STRUCTURE
Organization Name
Inventor(s)
Sungchul Park of Suwon-si (KR)
FOLDABLE ELECTRONIC DEVICE COMPRISING HEAT-DISSIPATING STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18039656 titled 'FOLDABLE ELECTRONIC DEVICE COMPRISING HEAT-DISSIPATING STRUCTURE
Simplified Explanation
The abstract describes a heat dissipating structure for a foldable electronic device. The device consists of two housings connected by a hinge assembly, with a flexible display spanning across the hinge. The structure includes a first plate between the display and the first housing, a second plate between the display and the second housing, and a heat dissipating structure between the first component and the hinge housing. This structure allows for the transfer of heat generated by the first component to the hinge housing.
- The patent describes a heat dissipating structure for a foldable electronic device.
- The device has two housings connected by a hinge assembly.
- A flexible display spans across the hinge and can fold depending on the rotation of the hinge assembly.
- The structure includes a first plate between the display and the first housing, and a second plate between the display and the second housing.
- A heat dissipating structure is located between the first component and the hinge housing.
- The heat dissipating structure transfers heat generated by the first component to the hinge housing.
Potential Applications
- Foldable smartphones or tablets
- Foldable laptops or notebooks
- Foldable electronic book readers
Problems Solved
- Heat dissipation in foldable electronic devices
- Preventing overheating of components in foldable devices
Benefits
- Improved heat dissipation in foldable devices
- Enhanced performance and longevity of components
- Reduced risk of overheating and damage to the device
Original Abstract Submitted
A heat dissipating structure of a foldable electronic device is provided. The electronic device includes a first housing including a first component, a second housing including a second component, a hinge assembly rotatably coupling the first and second housings, a hinge housing accommodating the hinge assembly and disposed between the first and second housings, a flexible display disposed from one region of the first housing to a region of the second housing across the hinge assembly, and foldable depending on a rotation of the hinge assembly, a first plate disposed between the flexible display and the first housing, a second plate disposed between the flexible display and the second housing, and a first heat dissipating structure disposed between the first component and thermally coupled to one end of the hinge housing, and providing a first heat transfer path for transferring heat generated from the first component to the hinge housing.
