17983464. ON-CHIP INDUCTOR simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
ON-CHIP INDUCTOR
Organization Name
Inventor(s)
ON-CHIP INDUCTOR - A simplified explanation of the abstract
This abstract first appeared for US patent application 17983464 titled 'ON-CHIP INDUCTOR
Simplified Explanation
The abstract describes an on-chip inductor that includes a semiconductor substrate and multiple insulating layers stacked on top of it. The inductor consists of three spiral-shaped coil patterns that are inductively coupled to each other and placed on different layers. The first ends of these coil patterns overlap each other. The inductor also includes two vias that connect the overlapping first ends of the coil patterns.
- The on-chip inductor is made up of a semiconductor substrate and multiple insulating layers.
- It consists of three spiral-shaped coil patterns that are inductively coupled to each other.
- The coil patterns are placed on different layers of the insulating stack.
- The first ends of the coil patterns overlap each other.
- Two vias are used to connect the overlapping first ends of the coil patterns.
Potential Applications
- Integrated circuits and microchips
- Wireless communication devices
- Power management systems
- Radio frequency (RF) circuits
Problems Solved
- Integration of inductors into small-scale electronic devices
- Efficient coupling of inductors on a single chip
- Reduction of parasitic effects in on-chip inductors
Benefits
- Compact size and integration of inductors on a chip
- Improved performance and efficiency of electronic devices
- Reduced parasitic effects and improved signal quality
Original Abstract Submitted
An on-chip inductor includes a semiconductor substrate, a plurality of insulating layers stacked over the semiconductor substrate, and first, second and third spiral-shaped coil patterns. The first, second and third spiral-shaped coil patterns are inductively coupled to each other and sequentially disposed on respective layers among the plurality of insulating layers. Further, the first, second and third spiral-shaped coil patterns have respective first ends overlapping each other. The on-chip inductor further includes a first via connecting the respective first ends of the first and second spiral-shaped coil patterns to each other, and a second via connecting the respective first ends of the second and third spiral-shaped coil patterns to each other, where the first and second vias overlap each other.
