17974239. PLATING APPARATUS HAVING CONDUCTIVE LIQUID AND PLATING METHOD simplified abstract (Samsung Electronics Co., Ltd.)
PLATING APPARATUS HAVING CONDUCTIVE LIQUID AND PLATING METHOD
Organization Name
Inventor(s)
Jaesik Chung of Yongin-si (KR)
PLATING APPARATUS HAVING CONDUCTIVE LIQUID AND PLATING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 17974239 titled 'PLATING APPARATUS HAVING CONDUCTIVE LIQUID AND PLATING METHOD
Simplified Explanation
The abstract describes a plating apparatus that includes a body, a lip seal structure, and a conductive liquid. The body has a cathode, and the lip seal structure is designed to hold a wafer. The lip seal structure consists of a bottom portion, a contact portion that touches the wafer, and at least one partition structure protruding from the bottom portion's upper surface. The conductive liquid covers the upper surface of the bottom portion and serves to electrically connect the cathode and the wafer.
- The plating apparatus includes a body with a cathode.
- A lip seal structure is connected to the body and holds a wafer.
- The lip seal structure has a bottom portion, a contact portion, and at least one partition structure.
- The conductive liquid covers the upper surface of the bottom portion.
- The conductive liquid electrically connects the cathode and the wafer.
Potential Applications
- Semiconductor manufacturing
- Electroplating processes
- Surface finishing of electronic components
Problems Solved
- Provides a reliable and efficient method for plating wafers
- Ensures proper electrical connection between the cathode and the wafer
- Prevents leakage of the conductive liquid during the plating process
Benefits
- Improved plating accuracy and uniformity
- Enhanced productivity in semiconductor manufacturing
- Reduced risk of damage to wafers during plating process
- Minimized liquid leakage and contamination
Original Abstract Submitted
A plating apparatus may include a body, a lip seal structure connected to the body, and a conductive liquid. The body may include a cathode. The lip seal structure may be configured to hold a wafer. The lip seal structure may include a bottom portion, a contact portion connected to the bottom portion and contacting the wafer, and at least one partition structure protruding from an upper surface of the bottom portion. The conductive liquid may cover the upper surface of the bottom portion and may be configured to electrically connect the cathode and the wafer.
