17973731. SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND MEMORY SYSTEM simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND MEMORY SYSTEM
Organization Name
Inventor(s)
Kwangsook Noh of Suwon-si (KR)
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND MEMORY SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 17973731 titled 'SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND MEMORY SYSTEM
Simplified Explanation
The patent application describes a semiconductor device that includes an element region and a wiring region. The element region consists of a semiconductor substrate and multiple elements formed on it. The wiring region is located on top of the element region and includes an interlayer insulating layer, multiple wiring patterns, and a via structure.
- The element region contains a first input/output circuit that transmits and receives a first signal, and a second input/output circuit that transmits and receives a second signal different from the first signal.
- The wiring region consists of a coil pattern, which is a collection of wiring patterns that form an inductor circuit. The coil pattern is connected to the first input/output circuit.
- The via structure passes through the center of the coil pattern and connects to the second input/output circuit.
Potential applications of this technology:
- Integrated circuits and electronic devices that require efficient signal transmission and reception.
- Devices that utilize inductor circuits for various purposes, such as filtering, amplification, or energy storage.
Problems solved by this technology:
- Efficient transmission and reception of different signals through separate input/output circuits.
- Integration of inductor circuits into semiconductor devices without compromising performance or space efficiency.
Benefits of this technology:
- Improved signal integrity and reduced interference between different signals.
- Compact design and efficient use of space within the semiconductor device.
- Enhanced performance and functionality of integrated circuits and electronic devices.
Original Abstract Submitted
A semiconductor device includes an element region including a semiconductor substrate and a plurality of elements formed on the semiconductor substrate and a wiring region disposed on the element region and including an interlayer insulating layer, a plurality of wiring patterns in the interlayer insulating layer, and a via structure extending in a first direction, perpendicular to an upper surface of the semiconductor substrate in the interlayer insulating layer, wherein the plurality of elements include a first input/output circuit transmitting and receiving a first signal and a second I/O circuit transmitting and receiving a second signal, different from the first signal, the plurality of wiring patterns is a coil pattern includes an inductor circuit, the coil pattern is connected to the first I/O circuit, and the via structure passes through a center of the coil pattern and is connected to the second I/O circuit.
