17973217. LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES simplified abstract (Robert Bosch GmbH)
Contents
- 1 LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES
Organization Name
Inventor(s)
Holger Rumpf of Reutlingen (DE)
Charles Tuffile of Swansea MA (US)
Stephanie Karg of Stuttgart (DE)
Tobias Joachim Menold of Weil der Stadt (DE)
LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES - A simplified explanation of the abstract
This abstract first appeared for US patent application 17973217 titled 'LASER SEALING METHODS FOR CLOSING VENTHOLES OF MICROMECAHNICAL DEVICES
Simplified Explanation
The abstract describes a method of sealing a venthole in a micromechanical device using laser irradiation. Here are the key points of the innovation:
- Micromechanical device with a substrate, such as silicon
- Substrate has an upper surface, a venthole leading to a chamber, and a trench offset from the venthole
- Laser pulse applied to the substrate at or within the trench
- Melting of substrate below the upper surface to seal the venthole laterally from beneath
Potential Applications
The technology could be applied in various fields such as microelectronics, MEMS devices, sensors, and actuators.
Problems Solved
This innovation solves the problem of sealing ventholes in micromechanical devices without the need for additional materials or complex processes.
Benefits
- Simplifies the sealing process of ventholes in micromechanical devices
- Ensures a reliable and hermetic seal
- Increases the efficiency and performance of the devices
Potential Commercial Applications
"Sealing Ventholes in Micromechanical Devices Using Laser Irradiation" - A Breakthrough in Micromechanical Device Manufacturing
Possible Prior Art
There may be prior art related to laser sealing techniques in microfabrication processes, but specific examples are not provided in the abstract.
Unanswered Questions
How does this technology compare to traditional methods of sealing ventholes in micromechanical devices?
The article does not provide a direct comparison between this technology and traditional methods of sealing ventholes. Further research or experimentation would be needed to determine the advantages and disadvantages of each approach.
What are the potential limitations or challenges of using laser irradiation to seal ventholes in micromechanical devices?
The abstract does not mention any potential limitations or challenges associated with this technology. Additional studies or practical applications may reveal issues such as precision control, heat distribution, or scalability that could affect its implementation.
Original Abstract Submitted
A venthole of a micromechanical device is sealed with laser irradiation. A micromechanical device has a substrate, such as silicon. The substrate has an upper surface, and defines a venthole leading to a chamber that contains a device, and a trench extending downward from the upper surface and located offset from the venthole. A laser pulse is applied to the substrate at or within the trench. This causes a portion of the substrate located below the upper surface to melt and travel laterally to close off and seal the venthole laterally from beneath the upper surface.
