17969552. INTEGRATED CIRCUIT INTEGRATION OF T-COILS AT INTERFACES TO COMMUNICATION LINKS simplified abstract (QUALCOMM Incorporated)

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INTEGRATED CIRCUIT INTEGRATION OF T-COILS AT INTERFACES TO COMMUNICATION LINKS

Organization Name

QUALCOMM Incorporated

Inventor(s)

Patrick Isakanian of El Dorado Hills CA (US)

Srivatsan Thiruvengadam of Carlsbad CA (US)

Darius Valaee of San Diego CA (US)

INTEGRATED CIRCUIT INTEGRATION OF T-COILS AT INTERFACES TO COMMUNICATION LINKS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17969552 titled 'INTEGRATED CIRCUIT INTEGRATION OF T-COILS AT INTERFACES TO COMMUNICATION LINKS

Simplified Explanation

The abstract describes an integrated circuit (IC) with two transceiver interface circuits, each containing a T-coil, positioned in a staggered manner along the IC.

  • The IC includes a first transceiver interface circuit with a first T-coil.
  • A second transceiver interface circuit is present with a second T-coil, offset from the first T-coil.
  • The second transceiver interface circuit is staggered from the first transceiver interface circuit along a specific direction.

Potential Applications

The technology described in this patent application could be applied in:

  • Wireless communication systems
  • RFID technology
  • Sensor networks

Problems Solved

This technology helps in:

  • Improving signal transmission and reception efficiency
  • Reducing interference between transceiver circuits
  • Enhancing overall performance of the integrated circuit

Benefits

The benefits of this technology include:

  • Enhanced communication reliability
  • Increased data transfer speeds
  • Improved signal quality

Potential Commercial Applications

A potential commercial application for this technology could be in:

  • Mobile devices
  • Internet of Things (IoT) devices
  • Automotive electronics

Possible Prior Art

One possible prior art for this technology could be the use of staggered transceiver circuits in other types of integrated circuits for improved signal processing and communication efficiency.

Unanswered Questions

How does this technology compare to existing transceiver interface circuits in terms of performance and efficiency?

This article does not provide a direct comparison with existing transceiver interface circuits to evaluate the performance and efficiency differences.

What specific manufacturing processes are required to implement the staggered transceiver interface circuits in the integrated circuit?

The article does not delve into the specific manufacturing processes needed to incorporate the staggered transceiver interface circuits into the integrated circuit.


Original Abstract Submitted

An integrated circuit (IC) including a first transceiver interface circuit extending longitudinally in a first direction substantially perpendicular to a second direction parallel to edge of the IC, wherein the first transceiver interface circuit comprises a first T-coil; and a second transceiver interface circuit extending longitudinally in the first direction, wherein the second transceiver interface circuit is staggered from the first transceiver interface circuit along the second direction, wherein the second transceiver interface circuit includes a second T-coil, and wherein the second T-coil is offset from the first T-coil along the first direction.