17969535. ELECTRONIC DEVICE INCLUDING VENT STRUCTURE AND HEAT DISSIPATION STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
ELECTRONIC DEVICE INCLUDING VENT STRUCTURE AND HEAT DISSIPATION STRUCTURE
Organization Name
Inventor(s)
Seunghoon Lee of Suwon-si (KR)
ELECTRONIC DEVICE INCLUDING VENT STRUCTURE AND HEAT DISSIPATION STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17969535 titled 'ELECTRONIC DEVICE INCLUDING VENT STRUCTURE AND HEAT DISSIPATION STRUCTURE
Simplified Explanation
The wearable electronic device described in this patent application includes a housing, a printed circuit board with a processor, a display module with a display, and a vent hole in the housing.
- The device also includes a connection member that electrically connects the printed circuit board and the display module, and has a vent region facing the vent hole.
- A heat dissipation member made of a material with high thermal conductivity is placed on the connection member, covering part of the vent region.
- A vent bracket with a vent channel is positioned between the heat dissipation member and the vent hole.
Potential applications of this technology:
- Wearable electronic devices such as smartwatches, fitness trackers, or augmented reality glasses.
- Any device that requires heat dissipation and ventilation, such as smartphones or tablets.
Problems solved by this technology:
- Overheating of wearable electronic devices due to limited space for heat dissipation.
- Ensuring proper ventilation to prevent damage to internal components.
Benefits of this technology:
- Improved heat dissipation, leading to better performance and longer lifespan of the device.
- Enhanced durability and reliability by preventing overheating and component damage.
- Compact design that allows for efficient heat dissipation in a small form factor.
Original Abstract Submitted
A wearable electronic device according to various embodiments disclosed herein may include: a housing, a printed circuit board on which a processor is disposed, a display module including a display, a vent hole disposed at the housing, a connection member comprising a conductor and including a vent region facing the vent hole and electrically connecting the printed circuit board and the display module, a heat dissipation member comprising a material having high thermal conductivity and disposed at the connection member and at least a part of which covers at least a part of the vent region, and a vent bracket including a vent channel connected to the vent hole and is disposed between the heat dissipation member and the vent hole.
