17969260. Local VDD And VSS Power Supply Through Dummy Gates with Gate Tie-Downs and Associated Benefits simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

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Local VDD And VSS Power Supply Through Dummy Gates with Gate Tie-Downs and Associated Benefits

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

Ruilong Xie of Niskayuna NY (US)

Nicholas Anthony Lanzillo of Wynantskill NY (US)

Lawrence A. Clevenger of Saratoga Springs NY (US)

Hosadurga Shobha of Niskayuna NY (US)

Huai Huang of Clifton Park NY (US)

Local VDD And VSS Power Supply Through Dummy Gates with Gate Tie-Downs and Associated Benefits - A simplified explanation of the abstract

This abstract first appeared for US patent application 17969260 titled 'Local VDD And VSS Power Supply Through Dummy Gates with Gate Tie-Downs and Associated Benefits

Simplified Explanation

The integrated circuit structure described in the patent application includes a power supply rail formed in the backside of a semiconductor wafer, connected to a frontside BEOL wire layer through a gate that is powered off by a power supply coupled through the gate from the power supply rail.

  • Power supply rail formed in the backside of a semiconductor wafer
  • Gate in the semiconductor wafer
  • Frontside BEOL wire layer connected to the power supply rail through the gate
  • Gate powered off by a power supply coupled through the gate from the power supply rail to the frontside BEOL wire layer

Potential Applications

This technology could be applied in:

  • Integrated circuits
  • Semiconductor devices
  • Power management systems

Problems Solved

This technology helps in:

  • Efficient power distribution
  • Improved circuit performance
  • Enhanced reliability of integrated circuits

Benefits

The benefits of this technology include:

  • Enhanced power supply distribution
  • Increased circuit efficiency
  • Improved overall performance of integrated circuits

Potential Commercial Applications

Potential commercial applications of this technology could be in:

  • Semiconductor manufacturing industry
  • Electronics industry
  • Power management sector

Possible Prior Art

One possible prior art could be:

  • Power supply distribution systems in integrated circuits

Unanswered Questions

How does this technology impact the overall cost of manufacturing integrated circuits?

The cost implications of implementing this technology in the manufacturing process are not discussed in the article.

Are there any limitations to the size or scale at which this technology can be effectively implemented?

The scalability and size limitations of this technology are not addressed in the article.


Original Abstract Submitted

An integrated circuit structure includes a power supply rail formed in a backside of a semiconductor wafer. The integrated circuit structure also includes a frontside BEOL wire layer connected to the power supply rail through a gate, wherein the gate is of a type to be powered off by a power supply coupled through the gate from the power supply rail to the first frontside BEOL wire layer. A method of forming an integrated circuit structure includes forming a power supply rail in a backside of a semiconductor wafer, forming a gate in the semiconductor wafer, and forming a frontside BEOL wire layer connected to the power supply rail through the gate. Again, the gate is of a type to be powered off by a power supply coupled through the gate from the power supply rail to the first frontside BEOL wire layer.